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Samtec ERF8 Series Straight Surface PCB Socket 60-Contact 2 Row 0.8 mm Pitch Solder

Category PCB Socket Brand Samtec Condition New

Specifications

Country of Origin India
Voltage 318V
Brand Samtec
Orientation Straight
Current 2.2A
Model ERF8
Mount Type Surface
Housing Material Liquid Crystal Polymer
Contact Material Beryllium Copper Alloy
Series ERF8
Termination Type Solder
Maximum Operating Temperature 125°C
Sub Type Rugged High-Speed Socket Strip
Minimum Operating Temperature -55°C
Number of Rows 2
Positions Up to 200
Pitch 0.8mm
Contact Plating Gold
Number of Contacts 60
Connector System Board-to-Board
Stacking Height 18mm
Row Pitch 4.5mm
Stack Height 7.00 mm - 16.00 mm

Key Features

  • Rugged Edge Rate® contact ensures reliable connection with smooth, broad milled surfaces for increased wear life.
  • Constructed with liquid crystal polymer housing for durable performance.
  • Rated for current of 2.2 A and voltage up to 318 V.
  • Surface mount type with straight orientation and 18 mm stacking height.
  • Contact material made of beryllium copper alloy plated with gold for corrosion resistance.
  • Operating temperature range from -55°C to 125°C suitable for demanding environments.
  • Board-to-board connector system designed for high-speed signal transmission up to 28+ Gbps.
  • Dual sourced by Hirose® ensuring quality and supply security.

Product Description

Samtec ERF8 ERF8-030-05.0-L-DV-K-TR is a rugged high-speed PCB socket designed for advanced electronic applications requiring durable and reliable board-to-board connectivity. Featuring 60 contacts arranged in 2 rows with a 0.8 mm pitch, this surface mount socket is engineered with a liquid crystal polymer housing and beryllium copper alloy contacts plated with gold to ensure excellent conductivity and long wear life.

The socket supports currents up to 2.2 A and a voltage rating of 318 V, making it suitable for power and signal applications with stringent performance requirements. Its straight orientation and 18 mm stacking height provide design flexibility for dense PCB layouts and multi-board stacking systems. Operating reliably within a broad temperature range from -55°C to 125°C, the ERF8 series meets the demands of industrial, commercial, and high-speed data transmission environments.

The connector system supports up to 200 positions with a row pitch of 4.5 mm, catering to various configuration needs in complex PCB designs.

This product is ideal for electronics manufacturing, telecommunications, laboratory instrumentation, data centers, and other high-performance electronic systems requiring reliable, high-speed PCB sockets. It complies with no specific standards or approvals, emphasizing application-specific rigorous mechanical and electrical characteristics.

Rugged Edge Rate® contact provides increased wear life and reliability. Liquid crystal polymer housing offers durability under stressful conditions. Gold-plated beryllium copper alloy contacts resist corrosion and maintain conductivity.

Supports 2.2 A current and 318 V voltage for versatile applications. Wide operating temperature range from -55°C to 125°C ensures environmental robustness. Surface mount with straight orientation simplifies PCB assembly.

Stacking height of 18 mm enables multi-board configurations. Board-to-board connector system supports high-speed signal transmission up to 28+ Gbps. Dual sourced by Hirose® ensures supply chain reliability. Positions up to 200 with 4.5 mm row pitch for scalable designs.

Explore more in the PCB Sockets category to find compatible connectors and accessories to enhance your electronic assembly projects.

Samtec ERF8 Series Straight Surface PCB Socket 60-Contact 2 Row 0.8 mm Pitch Solder
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Frequently Asked Questions

The maximum voltage rating for this model is 318 V.

This socket is rated for a current of up to 2.2 A.

The housing is made of liquid crystal polymer, and the contacts are made of beryllium copper alloy plated with gold.

It operates within a temperature range from -55°C to 125°C.

This model features 60 contacts arranged in 2 rows.

The pitch size of the contacts is 0.8 mm.

The stacking height of this unit is 18 mm.

This socket uses solder termination type.

It utilizes a board-to-board connector system designed for high-speed signal transmission.

The row pitch for this model is 4.5 mm.

Yes, it supports high-speed signal transmission up to 28+ Gbps.

The country of origin for this socket is India.

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