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| Country of Origin | India |
|---|---|
| Voltage | 318V |
| Brand | Samtec |
| Orientation | Straight |
| Current | 2.2A |
| Model | ERF8 |
| Mount Type | Surface |
| Housing Material | Liquid Crystal Polymer |
| Contact Material | Beryllium Copper Alloy |
| Series | ERF8 |
| Termination Type | Solder |
| Maximum Operating Temperature | 125°C |
| Sub Type | Rugged High-Speed Socket Strip |
| Minimum Operating Temperature | -55°C |
| Number of Rows | 2 |
| Positions | Up to 200 |
| Pitch | 0.8mm |
| Contact Plating | Gold |
| Number of Contacts | 60 |
| Connector System | Board-to-Board |
| Stacking Height | 18mm |
| Row Pitch | 4.5mm |
| Stack Height | 7.00 mm - 16.00 mm |
Samtec ERF8 ERF8-030-05.0-L-DV-K-TR is a rugged high-speed PCB socket designed for advanced electronic applications requiring durable and reliable board-to-board connectivity. Featuring 60 contacts arranged in 2 rows with a 0.8 mm pitch, this surface mount socket is engineered with a liquid crystal polymer housing and beryllium copper alloy contacts plated with gold to ensure excellent conductivity and long wear life.
The socket supports currents up to 2.2 A and a voltage rating of 318 V, making it suitable for power and signal applications with stringent performance requirements. Its straight orientation and 18 mm stacking height provide design flexibility for dense PCB layouts and multi-board stacking systems. Operating reliably within a broad temperature range from -55°C to 125°C, the ERF8 series meets the demands of industrial, commercial, and high-speed data transmission environments.
The connector system supports up to 200 positions with a row pitch of 4.5 mm, catering to various configuration needs in complex PCB designs.
This product is ideal for electronics manufacturing, telecommunications, laboratory instrumentation, data centers, and other high-performance electronic systems requiring reliable, high-speed PCB sockets. It complies with no specific standards or approvals, emphasizing application-specific rigorous mechanical and electrical characteristics.
Rugged Edge Rate® contact provides increased wear life and reliability. Liquid crystal polymer housing offers durability under stressful conditions. Gold-plated beryllium copper alloy contacts resist corrosion and maintain conductivity.
Supports 2.2 A current and 318 V voltage for versatile applications. Wide operating temperature range from -55°C to 125°C ensures environmental robustness. Surface mount with straight orientation simplifies PCB assembly.
Stacking height of 18 mm enables multi-board configurations. Board-to-board connector system supports high-speed signal transmission up to 28+ Gbps. Dual sourced by Hirose® ensures supply chain reliability. Positions up to 200 with 4.5 mm row pitch for scalable designs.
Explore more in the PCB Sockets category to find compatible connectors and accessories to enhance your electronic assembly projects.
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