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Samtec ERF8 Series Rugged High-Speed Straight Surface PCB Socket 100-Contact 2 Row 0.8 mm Pitch Solder ERF8

Category PCB Socket Brand Samtec Condition New

Specifications

Country of Origin India
Voltage 318V
Brand Samtec
Orientation Straight
Current 2.2A
Model ERF8
Mount Type Surface
Housing Material Liquid Crystal Polymer
Contact Material Beryllium Copper Alloy
Series ERF8
Termination Type Solder
Maximum Operating Temperature 125°C
Sub Type Rugged High-Speed Socket Strip
Minimum Operating Temperature -55°C
Number of Rows 2
Positions Up to 200
Pitch 0.8mm
Contact Plating Gold
Number of Contacts 100
Connector System Board-to-Board
Stacking Height 18mm
Row Pitch 4.5mm
Stack Height 7.00 mm - 16.00 mm

Key Features

  • Constructed from Liquid Crystal Polymer housing for durability and stability.
  • Features Beryllium Copper Alloy contacts with gold plating for enhanced conductivity and corrosion resistance.
  • Designed for operating temperatures ranging from -55°C to 125°C.
  • Supports a current rating of 2.2A and a voltage rating of 318V for reliable performance.
  • Stacking height is 18 mm, with row pitch of 4.5 mm to accommodate rugged high-speed applications.
  • Surface mount technology provides straight orientation and easy PCB integration.
  • Compliant with industry standards, suitable for industrial, electronic component manufacturing, and high-speed data transfer applications.
  • Dual sourced by Hirose ensuring component availability and quality.

Product Description

Samtec ERF8 Rugged High-Speed Straight Surface PCB Socket (Model ERF8) is engineered specifically for high-performance board-to-board connectivity with a 100-contact, 2-row configuration and a fine 0.8 mm pitch. The socket's housing is made of Liquid Crystal Polymer, delivering excellent mechanical strength and heat resistance, suitable for demanding electronic and industrial environments.

The contacts utilize Beryllium Copper Alloy with gold plating to ensure excellent electrical conductivity and long-term durability under varying conditions. Rated for 2.2A current and operating voltage of 318V, it performs reliably across a broad temperature range from -55°C to 125°C, accommodating various thermal environments.

This surface-mount socket features a straight orientation with an 18 mm stacking height and a row pitch of 4.5 mm, optimized for rugged high-speed socket strip applications. Its rugged edge rate contact design provides a smooth broad milled contact surface that enhances wear life and signal integrity, supporting data rates up to 28+ Gbps.

Designed primarily for industrial, electronic manufacturing, laboratory testing, and high-speed communication applications, this socket supports stringent requirements in terms of reliability and mechanical endurance. The product is dual sourced by Hirose, reflecting trusted availability and compliance with the latest performance standards.

Constructed with Liquid Crystal Polymer housing for robust durability. Beryllium Copper Alloy contacts with gold plating enhance conductivity and corrosion resistance. Supports 2.2A current and 318V operating voltage for reliable electrical performance.

Operates effectively within -55°C to 125°C temperature range. Surface mount design with straight orientation and 18 mm stacking height. Configurable up to 200 positions with rugged edge rate contact design. Ideal for industrial, electronic components manufacturing, and high-speed data transmission.

Complies with high-speed socket strip ruggedness standards and dual sourced by Hirose. Explore the wide selection of PCB Sockets and connectors available at EnvMart for your electronic assembly and manufacturing needs.

Samtec ERF8 Series Rugged High-Speed Straight Surface PCB Socket 100-Contact 2 Row 0.8 mm Pitch Solder ERF8
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Frequently Asked Questions

This model supports a current rating of 2.2A, ensuring reliable electrical performance in various applications.

The voltage rating for the Samtec ERF8 is 318V, suitable for high-speed data transfer and industrial applications.

The housing of this socket is made from Liquid Crystal Polymer, while the contacts are constructed from Beryllium Copper Alloy with gold plating for enhanced conductivity and corrosion resistance.

The Samtec ERF8 operates effectively within a temperature range of -55°C to 125°C, accommodating various thermal environments.

This socket features 100 contacts, arranged in a 2-row configuration with a 0.8 mm pitch.

The stacking height of this model is 18 mm, designed for rugged high-speed applications.

This socket utilizes solder termination, suitable for secure connections on PCBs.

The row pitch for this PCB socket is 4.5 mm, facilitating efficient board-to-board connectivity.

This model is primarily designed for industrial, electronic manufacturing, laboratory testing, and high-speed communication applications.

The rugged edge rate contact design of this socket enhances wear life and signal integrity, supporting data rates up to 28+ Gbps.

The country of origin for this product is India, reflecting its manufacturing quality standards.

This socket is designed as a board-to-board connector system, enabling efficient connectivity between PCBs.

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