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| Country of Origin | India |
|---|---|
| Voltage | 318V |
| Brand | Samtec |
| Orientation | Right Angle |
| Current | 2.2A |
| Model | ERF8 |
| Mount Type | Surface |
| Housing Material | Liquid Crystal Polymer |
| Contact Material | Beryllium Copper Alloy |
| Series | ERF8 |
| Termination Type | Solder |
| Maximum Operating Temperature | 125°C |
| Sub Type | Rugged High-Speed Socket Strip |
| Minimum Operating Temperature | -55°C |
| Number of Rows | 2 |
| Positions | Up to 200 |
| Pitch | 0.8mm |
| Contact Plating | Gold |
| Number of Contacts | 120 |
| Connector System | Board-to-Board |
| Stacking Height | 18mm |
| Row Pitch | 4.5mm |
| Stack Height | 7.00 mm - 16.00 mm |
Samtec ERF8 Rugged High-Speed Socket Strip PCB Socket (model ERF8) is engineered for demanding electronic applications requiring reliable high-speed connections. It offers 120 contacts arranged in 2 rows with a fine 0.8 mm pitch, designed as a right angle surface mount socket for efficient board-to-board interfacing.
The housing is made from liquid crystal polymer, providing excellent mechanical strength and thermal stability. Contacts are made of beryllium copper alloy plated with gold to ensure consistent conductivity and resistance to wear in repetitive mating cycles. This socket supports a current rating of 2.2 amperes and a voltage rating up to 318 volts, making it suitable for various power and signal transmission requirements.
Its stacking height of 18 mm allows integration into compact electronic assemblies without sacrificing performance. The product is rated for operation in extreme temperature ranges from -55°C up to 125°C, supporting use in industrial, automotive, and other harsh environment applications.
The solder termination type guarantees robust attachment to PCB pads, while the right angle orientation provides design flexibility in electronic system layouts. This rugged socket strip is part of Samtec's ERF8 series, recognized for high-speed edge-rate contact technology optimized for signal integrity up to 28+ Gbps, ideal for modern high-frequency communications equipment.
Supports 120 contacts in a 2-row configuration for dense interconnect solutions. Liquid crystal polymer housing ensures durability and thermal resistance. Beryllium copper alloy contacts with gold plating enhance signal quality and longevity.
Right angle surface mount design facilitates PCB layout optimization. Certified for current up to 2.2A and voltage up to 318V for diverse electronic applications. Wide operating temperature range (-55°C to 125°C) accommodates industrial environments.
Solder termination ensures secure PCB connection. Stacking height of 18 mm supports multi-level PCB assembly designs. Suitable for industrial, laboratory, manufacturing, and commercial electronic uses. Supports high-speed data transmission compliant with Samtec 28+ Gbps standards.
Explore the Samtec brand collection and PCB Sockets category at EnvMart for more advanced connector solutions tailored to your project requirements.
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