Wurth Elektronik WE-MK Unshielded Multilayer Surface Mount Inductor with Ceramic Core 3.3 nH 5% Tolerance 320 mA 7447820033

Wurth Elektronik model 7447820033 is an unshielded multilayer surface mount inductor featuring a ceramic core and 3.3 nH inductance with 5% tolerance. It is designed for use in high-frequency circuits including Bluetooth and wireless LAN applications, offering high stability across temperature ranges.

The inductor construction integrates the coil within a multilayer ceramic structure which ensures compactness of 0.6 mm length, 0.3 mm height, and 0.3 mm depth. It supports a maximum DC current of 320 mA, making it suitable for moderate current demands.

Standards compliance includes RoHS, REACH, JEDEC JS709B, and IEC 61249-2-21, guaranteeing environmental and manufacturing quality. It is automotive qualified under AEC-Q200 standards, reinforcing its reliability in automotive electronic systems.

The core material is ceramic which contributes to a minimum quality factor of 4 and a high maximum self-resonant frequency of 6.7 GHz. It operates efficiently in temperatures ranging from -55°C to +125°C.

This inductor's unshielded design provides stable inductance over temperature with an inductance tolerance of 5%. Its surface mount termination style allows for easy PCB integration.

Unshielded multilayer construction provides stable inductance over temperature. Maximum DC current rating of 320 mA supports moderate current flow. Compact dimensions: 0.6 mm length, 0.3 mm height, and 0.3 mm depth. Compliance with RoHS, REACH, JEDEC JS709B, and IEC 61249-2-21 standards.

Suitable for automotive applications meeting AEC-Q200 standard. Core made from ceramic material ensuring reliability and stability. Operating temperature range from -55°C to +125°C for harsh environments. Maximum self-resonant frequency of 6.7 GHz for high-frequency circuit use.

This Wurth Elektronik multilayer surface mount inductor is suitable for industrial, laboratory, automotive, and communication equipment manufacturing, particularly for high-frequency and wireless applications. It is offered with tape and reel packaging for automated assembly processes.

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