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MBO Lead Solder Wire 0.7 mm Diameter, 63% Tin, 37% Lead, Rosin Flux, Melting Point SN63 PB 7/10 SANS NETTOYAGE RT15 - 500G
Specifications
| Country of Origin | France |
|---|---|
| Brand | MBO |
| Model | SN63 PB 7/10 SANS NETTOYAGE RT15 - 500G |
| Melting Point | 183°C |
| Product Weight | 500g |
| Wire Diameter | 0.7mm |
| Product Form | Wire |
| Percent Lead | 37% |
| Percent Tin | 63% |
| Flux Type | Rosin |
| MBO Wire, 1 mm Lead Solder, 183 °C Melting PointBrand | MBO |
| Chlorine | 0 % |
| Flux ratio | 1.5 % |
Key Features
- This lead solder wire has a melting point of 183 °C, suitable for various soldering tasks.
- It contains 37% lead with rosin flux type designed for effective wetting and minimal residue.
- The wire weighs 500 grams, providing ample material for medium-scale soldering projects.
- The solder alloy is non-activated and no-clean, generating minimal fumes during use.
- Designed specifically for SMD repair applications with excellent wetting on tin-plated substrates.
- Contains 0% chlorine and a flux ratio of 1.5%, ensuring safer handling.
- Manufactured in France, guaranteeing quality and reliability.
Product Description
MBO SN63 PB 7/10 SANS NETTOYAGE RT15 - 500G lead solder wire features a 0.7 mm diameter wire form composed of 63% tin and 37% lead, with a melting point of 183 °C. It is a non-activated, no-clean solder alloy integrated with rosin flux designed for precision and minimal post-solder cleanup. This solder wire is ideal for industrial and laboratory soldering tasks, especially in Surface Mount Device (SMD) repair applications where excellent wetting on tin-plated substrates is required.
The solder wire generates minimal fumes and residue during usage, enhancing soldering safety and ease. The flux ratio of 1.5% and zero chlorine content further supports safe handling and reduced corrosion risk of electronic components. Made in France, this product meets strict quality controls suitable for electronics manufacturing, repair, and prototyping.
Its 500 gram weight supplies enough solder for medium volume use in electronics assembly and repair workshops. This lead solder wire is widely used across industries such as electronics production, maintenance, laboratory prototyping, and precision engineering.
This lead solder wire has a melting point of 183 °C, suitable for various soldering tasks. It contains 37% lead with rosin flux type designed for effective wetting and minimal residue. The wire weighs 500 grams, providing ample material for medium-scale soldering projects.
The solder alloy is non-activated and no-clean, generating minimal fumes during use. Designed specifically for SMD repair applications with excellent wetting on tin-plated substrates. Contains 0% chlorine and a flux ratio of 1.5%, ensuring safer handling.
Manufactured in France, guaranteeing quality and reliability. Explore our extensive category of Solder Wires for various industrial and laboratory soldering needs at EnvMart.
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Frequently Asked Questions
The solder wire has a melting point of 183 °C, making it suitable for various soldering tasks.
This model features a wire diameter of 0.7 mm.
It is composed of 63% tin and 37% lead, with a rosin flux type designed for effective wetting and minimal residue.
The wire weighs 500 grams, providing ample material for medium-scale soldering projects.
This solder wire contains a rosin flux type, which is non-activated and no-clean, generating minimal fumes during use.
The solder wire contains 0% chlorine, ensuring safer handling and reduced corrosion risk of electronic components.
The flux ratio is 1.5%, which supports safe handling during soldering tasks.
This solder wire is manufactured in France, ensuring quality and reliability.
It is ideal for industrial and laboratory soldering tasks, especially in Surface Mount Device (SMD) repair applications.
The solder alloy generates minimal fumes and residue during usage, enhancing soldering safety and ease.
This solder wire is widely used across industries such as electronics production, maintenance, laboratory prototyping, and precision engineering.
It provides excellent wetting on tin-plated substrates and is designed for precision with minimal post-solder cleanup.
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