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Samtec TSM Series Vertical Surface Pin Header, 34 Contacts, 2.54 mm Pitch, 2 Row, Unshrouded TSM-117-01-F-DV
Specifications
| Country of Origin | India |
|---|---|
| Voltage | 475V |
| Brand | Samtec |
| Orientation | Vertical |
| Model | TSM-117-01-F-DV |
| Mount Type | Surface |
| Housing Material | Liquid Crystal Polymer |
| Contact Material | Phosphor Bronze |
| Series | TSM |
| Termination Type | Solder |
| Maximum Operating Temperature | 125°C |
| Minimum Operating Temperature | -55°C |
| Number of Rows | 2 |
| Pitch | 2.54mm |
| Contact Plating | Gold or Tin |
| Number of Contacts | 34 |
| Contact Gender | Male |
| Shrouded/Unshrouded | Unshrouded |
| Connector System | Board-to-Board |
Key Features
- Features a vertical orientation for PCB mount applications.
- Composed of phosphor bronze contact material with gold or tin plating.
- Housing made from liquid crystal polymer ensuring high durability.
- Supports operating temperature range from -55°C to 125°C.
- Designed for voltage rating up to 475V AC.
- Solder termination type for secure connections.
- Unshrouded style for easy pin access.
- Connector system configured for board-to-board interfaces.
Product Description
Samtec TSM-117-01-F-DV is a vertical surface mount pin header belonging to the TSM series, featuring 34 contacts arranged in 2 rows with a 2.54 mm pitch. This unshrouded pin header incorporates a black liquid crystal polymer housing and phosphor bronze contacts. It uses gold flash plating on the posts and matte tin on the tails to ensure reliable electrical connections and corrosion resistance.
This PCB header is designed for board-to-board connector systems, providing a robust and compact solution suitable for electronic, industrial, and communication equipment. The vertical orientation allows for versatile mounting on PCB surfaces where height and layout flexibility are critical.
Operating temperature ranges from -55°C to 125°C, making it suitable for harsh environments in industrial and commercial applications. It supports a voltage rating of up to 475 VAC, ensuring safe and stable signal transmission in demanding electronic assemblies.
The termination type is solder, ensuring strong mechanical and electrical connections on the PCB. The unshrouded design facilitates ease of inspection and rework without compromising the connector’s stability.
Manufactured with compliance to industry requirements, though no specific certifications or approvals are listed. The compact design and high-quality materials make it ideal for use in electronics manufacturing, prototyping, robotics, and other high-reliability applications.
Features a vertical orientation for PCB mount applications. Composed of phosphor bronze contact material with gold or tin plating. Housing made from liquid crystal polymer ensuring high durability. Supports operating temperature range from -55°C to 125°C.
Designed for voltage rating up to 475V AC. Solder termination type for secure connections. Unshrouded style for easy pin access. Connector system configured for board-to-board interfaces. Explore more PCB Headers and connectors from Samtec and other brands at EnvMart for industrial, electronics manufacturing, telecommunications, and lab equipment applications.
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Frequently Asked Questions
The contacts in this pin header have a pitch of 2.54 mm.
This model supports a maximum operating temperature of 125°C.
The pin header features 34 contacts arranged in 2 rows.
It is designed for a voltage rating of up to 475V AC.
The housing is made from liquid crystal polymer, and the contacts are composed of phosphor bronze with gold or tin plating.
This model uses a solder termination type for secure connections.
The TSM-117-01-F-DV is designed as an unshrouded pin header, allowing for easy pin access.
This pin header has a vertical orientation for PCB mount applications.
It is configured for board-to-board connector systems.
The minimum operating temperature is -55°C.
The country of origin for this product is India.
It is suitable for use in electronics manufacturing, prototyping, robotics, and other high-reliability applications.
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