Samtec SHF Series Right Angle Through Hole PCB Header 24 Contacts 1.27 mm Pitch 2 Row Shrouded SHF-112-01-L-D-RA

Samtec presents the SHF Series Right Angle Through Hole PCB Header, model SHF-112-01-L-D-RA, featuring a compact 1.27 mm pitch and 24 contacts arranged in 2 rows. This shrouded header enables secure board-to-wire connections in electronic assemblies.

The product housing is made from black liquid crystal polymer, providing mechanical strength and heat resistance for demanding applications. Contact pins are fabricated from phosphor bronze and plated with silver and tin to ensure excellent conductivity and corrosion resistance.

Designed for through-hole mounting with solder termination, this header supports reliable electrical and mechanical connections on PCBs. Operating temperature ranges from -55 °C to +125 °C make it suitable for varied industrial environments.

The right angle orientation allows for efficient space utilization on circuit boards, making it ideal for compact and complex electronic designs. The 1.27 mm pitch between pins and rows enables high-density connections.

The shrouded design protects the contacts against accidental damage, short circuits, and foreign object ingress, increasing the durability and lifespan of assemblies. The header features a right angle orientation for board-to-wire connection.

Constructed with a durable black liquid crystal polymer housing. Contacts are male phosphor bronze plated with silver and tin for reliable conductivity. Designed for through-hole mounting and solder termination. Operates reliably within -55°C to 125°C temperature range.

Pitch between pins and rows is 1.27 mm for compact PCB layouts. RoHS compliant, ensuring environmentally friendly materials. Shrouded design protects contacts from damage and accidental shorts.

This Samtec SHF Series PCB Header is widely used in industrial electronics, telecommunications equipment, computing devices, and other applications demanding rugged and reliable PCB connections. It fits perfectly in manufacturing, testing, and repair environments.

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