World's First Climate Tech Platform | Free Delivery in India | Global Shipping

Become Seller

For Bulk Enquiry: sales@envmart.com

Shopping Cart $0.00

Vero Technologies 96 Way Backplane Epoxy Glass Fabric Laminate 2 Sides 84 HP with 15.24 mm Connector Pitch 222-2470

Free Delivery in India | Lowest Global Shipping Charges

Vero Technologies 96 Way Backplane Epoxy Glass Fabric Laminate 2 Sides 84 HP with 15.24 mm Connector Pitch 222-2470

Name: Vero Technologies 96 Way Backplane Epoxy Glass Fabric Laminate 2 Sides 84 HP with 15.24 mm Connector Pitch 222-2470
Brand: Vero Technologies
SKU: 137474
Price: 349.42 USD
Availability: InStock



Category Backplane Connectors Brand Vero Technologies Condition New

Specifications

Country of Origin	United Kingdom
Display	screen
Brand	Vero Technologies
Model	222-2470
Sub Type	Microbus Backplanes
External Width	20mm
External Height	130mm
Pitch	15.24mm
Board Material	Epoxy Glass Fabric Laminate
Standards/Approvals	RoHS, EP-GC-Cu3 FR4, BS 4584
Number of Contacts	96
Horizontal Pitch	84HP
Number of Sides	2
Board Thickness	1.6mm
Copper Thickness	35μm

Key Features

Manufactured using durable epoxy glass fabric laminate material.
Double-sided board construction for enhanced connectivity.
Features 96 contacts suitable for high speed logic systems.
Standard 15.24 mm horizontal connector pitch ensures compatibility with DIN41612 connectors.
Board thickness of 1.6 mm with copper thickness of 35 μm for optimal conductivity.
External dimensions of 20 mm width and 130 mm height fit standard rack mounts.
Designed to meet RoHS, EP-GC-Cu3 FR4, and BS 4584 standards.
Ideal for applications requiring screening between signal lines and glitch-free operation.

Product Description

Vero Technologies 222-2470 96 Way Backplane is crafted from epoxy glass fabric laminate material with double-sided 2-layer construction, designed for reliable performance in electronics prototyping and industrial applications.

This Eurocard format backplane has 96 contacts arranged with an 84 HP horizontal pitch and 15.24 mm connector pitch, compatible with DIN41612 connectors as per IEC297-3 standards. The board thickness is 1.6 mm, and it incorporates a copper thickness of 35 μm to guarantee excellent electrical conductivity.

The backplane features a colander ground plane on the component side for maximum screening, reducing interference and ensuring glitch-free high-speed logic operation. Its dimensions of 20 mm width and 130 mm height are optimized for integration into standard subracks and system enclosures.

Manufactured under strict compliance with RoHS regulations and British standards BS 4584 and EP-GC-Cu3 FR4, this backplane is suitable for both high speed and slower signal applications, providing versatility in electronic assembly and testing setups.

It is ideal for use in industrial, laboratory, manufacturing, and electronic component prototyping environments requiring robust and reliable backplane interconnections. Manufactured using durable epoxy glass fabric laminate material.

Double-sided construction with 2 sides and 1.6 mm thickness. Features 96 contacts arranged with 84 HP horizontal pitch and 15.24 mm connector pitch. Incorporates 35 μm copper thickness for effective conductivity. Conforms to RoHS, EP-GC-Cu3 FR4, and BS 4584 standards.

Dimensions: 20 mm width × 130 mm height. Designed for DIN41612 connector compatibility in IEC297-3 subracks. Colander ground plane for screening and glitch-free operation. Suitable for industrial, electronic prototyping, and high speed logic systems.

Explore the complete range of backplanes and related electronic components at EnvMart for your industrial and engineering applications.

Explore more products in our Backplane Connectors category.