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| Country of Origin | India |
|---|---|
| Voltage | 30V ac |
| Brand | TE Connectivity |
| Orientation | Straight |
| Current | 3A |
| Mount Type | Through Hole |
| Housing Material | Liquid Crystal Polymer |
| Contact Material | Phosphor Bronze |
| Series | Z-PACK |
| Termination Type | Solder |
| Maximum Operating Temperature | 125°C |
| Minimum Operating Temperature | -55°C |
| Number of Rows | 4 |
| Pitch | 2mm |
| Pay online using | Or choose to pay later via bank transfer |
| RS Stock No. | 361-7162Brand: TE ConnectivityManufacturers Part No.: 5536501-3 |
| Contact Plating | Gold over Nickel |
| Number of Contacts | 96 |
| Contact Gender | Male |
| Connector Gender | Male |
| Backplane Connector Type | Futurebus+ |
TE Connectivity 5536501-3 Z-PACK 2 mm Pitch Futurebus+ Backplane Connector is a high-quality backplane connector designed to provide a robust and efficient interconnection solution for electronic systems. This connector supports high-density and high-speed signal and power transmission with a 2 mm pitch across 96 contacts organized in 4 rows, suitable for demanding industrial and electronic applications.
The connector features a liquid crystal polymer housing, which offers strong mechanical and thermal stability. Phosphor bronze contacts plated with gold over nickel ensure excellent electrical conductivity and corrosion resistance. It is designed with a male, straight orientation facilitating straightforward connections to female counterparts.
The component is suitable for through-hole mounting with solder termination, providing secure and reliable attachment to printed circuit boards. Designed to withstand operating temperatures from -55°C to 125°C, it is suitable for harsh environments in industrial, telecommunications, computing, and other electronic sectors.
Supporting a current of up to 3A and operating voltage of 30V AC, this connector is compliant with Futurebus+ and IEC 1076-4-0X-(48B) standards, ensuring interoperability and compatibility with a wide range of electronic equipment.
The Z-PACK interconnection system’s modular and end-to-end stackable design enables flexible and scalable configurations, ideal for motherboards, backplanes, and other fixed board applications requiring reliable and efficient connections.
Features a 2 mm pitch with 96 contact points arranged in 4 rows. Constructed with a liquid crystal polymer housing for durability. Contacts composed of phosphor bronze with gold over nickel plating ensure excellent conductivity.
Designed for through hole mounting and solder termination type. Operates reliably between -55°C and 125°C temperature range. Supports operating voltage of 30V AC and current rating of 3A. Complies with Futurebus+ and IEC 1076-4-0X-(48B) standards.
Connector gender is male with a straight orientation to facilitate connections. Modular and stackable for flexible backplane configurations.
This backplane connector is well-suited for industrial automation, computer manufacturing, telecommunications equipment, and high-reliability electronic assemblies requiring secure and high-performance interconnections. For selecting compatible components and designing PCB layouts, comprehensive technical documents and 3D models are available.
Explore more products from TE Connectivity and related backplane connector solutions within the Electronics Components category at EnvMart.
Explore more products in our Backplane Connectors category.
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