Molex MicroClasp Series Vertical Through Hole PCB Header 12 Contacts 2mm Pitch 2 Row Shrouded 559171230

Molex 559171230 MicroClasp Series Vertical Through Hole PCB Header is designed for secure and efficient wire-to-board connections in electronic assemblies. This component features 12 contacts arranged in 2 rows with a precise 2 mm pitch, facilitating tight and reliable board layouts in compact spaces.

The housing is made of durable polyester material which ensures excellent electrical insulation and mechanical robustness under demanding conditions. Its vertical orientation and through hole mount type enable straightforward PCB integration with firm soldering.

Each contact is male, with tin plating to enhance corrosion resistance and ensure consistent electrical conductivity. The tail pins are 3.2 mm long, supporting secure solder terminations to minimize failures in electronic circuits.

With an operating temperature range from -40°C to 105°C, this PCB header is suitable for both industrial and commercial environments, withstanding considerable thermal stresses. The product is certified to UL E29179 standards, ensuring compliance with recognized safety and performance benchmarks.

Features a vertical orientation suitable for through hole mounting. Constructed with polyester housing ensuring durability and electrical insulation. Rated for 3A current and 250V voltage for moderate power applications.

Contacts are tin plated and male gender type with 3.2 mm tail pin length for solder termination. Designed to operate in extreme temperatures from -40°C up to 105°C. Compliant with UL E29179 standard ensuring quality and safety.

Wire-to-board connector system provides robust mechanical and electrical connection. Shrouded design offers added protection against accidental contact and mechanical damage.

This PCB header is ideal for industrial electronics manufacturing, telecommunications, computing hardware, and other applications requiring reliable, compact, and standardized PCB connectors. Its robust design supports longevity and stable performance in demanding environments.

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