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Infineon Controller IC CYUSB3014-BZXC, 1-Channel, 5 Gbps, 1.2-1.25V Power Supply, USB 2.0, 121-Pin BGA
Specifications
| Country of Origin | India |
|---|---|
| Brand | Infineon |
| Height | 1.05mm |
| Length | 10mm |
| Model | CYUSB3014-BZXC |
| Mount Type | Surface |
| Series | CYUSB301 |
| Maximum Operating Temperature | 70°C |
| Package Type | BGA |
| Sub Type | Controller |
| Minimum Operating Temperature | 0°C |
| Interfaces | USB signalling Single supply 1 |
| Pin Count | 121 |
| Maximum Supply Voltage | 1.25V |
| Minimum Supply Voltage | 1.2V |
| Maximum Data Rate | 5Gbps |
| Number of Transceivers | 1 |
| USB Specification | USB 2.0 |
| Supported Protocols | USB 2.0 |
Key Features
- Supports a single transceiver for USB 2.0 protocol signaling.
- Equipped with 121 pins in a low-profile BGA package for compact PCB layouts.
- Built-in electrostatic discharge (ESD) protection ensures robust signal integrity.
- Operates reliably in temperatures from 0°C to 70°C.
- Designed for surface-mount PCB integration to enable dense component placement.
- Supports a maximum data rate of 5 Gbps for high-throughput USB signaling.
- Single supply voltage between 1.2V and 1.25V simplifies power rail design.
- Compact dimensions facilitate usage in space-constrained designs.
Product Description
Infineon CYUSB3014-BZXC Controller IC is a high-performance interface controller designed for embedded systems requiring USB 2.0 connectivity. This device supports a maximum data rate of 5 Gbps and operates from a single supply voltage between 1.2V and 1.25V, simplifying the power supply design. Its 121-pin ball grid array (BGA) package promotes dense, surface-mounted PCB layouts while maintaining a low profile of 1.05mm in height and 10mm in length.
Built-in electrostatic discharge protection enhances reliability during handling and operation, making it well-suited for industrial peripherals, gateway modules, and compact consumer electronics. The controller provides one transceiver for robust differential USB signaling compliant with USB 2.0 standards.
Its operating temperature range spans from 0°C to 70°C, accommodating typical commercial environments. The device requires precise solder mask definition and careful reflow-profile control to ensure reliable PCB mounting due to its BGA form factor.
This controller offers a streamlined solution for embedded host or device applications, providing extensive input/output routing via its 121 pins. Its efficient power supply needs and high data throughput support the demands of modern electronic devices.
Applications include industrial USB peripherals, development boards, compact consumer devices needing minimal power rails, and gateway modules in constrained spaces. The CYUSB3014-BZXC is part of the Infineon CYUSB301 series known for combining performance with compact integration.
This device supports a single transceiver for USB 2.0 protocol signaling. Equipped with 121 pins in a low-profile BGA package for compact PCB layouts. Built-in electrostatic discharge (ESD) protection ensures robust signal integrity.
Operates reliably in temperatures from 0°C to 70°C. Designed for surface-mount PCB integration to enable dense component placement. Supports a maximum data rate of 5 Gbps for high-throughput USB signaling. Single supply voltage between 1.2V and 1.25V simplifies power rail design.
Compact dimensions facilitate usage in space-constrained designs. Ideal for embedded host or device controller applications. Offers extensive I/O options via 121-pin BGA packaging. Find the Infineon CYUSB3014-BZXC Controller IC and other semiconductor interface components at EnvMart for your industrial, commercial, or laboratory electronics projects.
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Frequently Asked Questions
The Infineon CYUSB3014-BZXC supports a maximum data rate of 5 Gbps for high-throughput USB signaling.
This model operates reliably in temperatures ranging from 0°C to 70°C, suitable for typical commercial environments.
The controller requires a single supply voltage between 1.2V and 1.25V, simplifying power rail design.
This controller IC is equipped with 121 pins in a low-profile BGA package, facilitating compact PCB layouts.
The CYUSB3014-BZXC uses a ball grid array (BGA) package, which is designed for surface-mount PCB integration.
Yes, it features built-in electrostatic discharge (ESD) protection to ensure robust signal integrity during handling and operation.
It supports USB 2.0 protocol signaling, compliant with USB 2.0 standards.
The height of this model is 1.05 mm, making it suitable for space-constrained designs.
This controller is suitable for applications including industrial USB peripherals, development boards, and compact consumer devices.
The length of the BGA package for this controller IC is 10 mm.
This model is part of the Infineon CYUSB301 series, known for combining performance with compact integration.
The mount type for the CYUSB3014-BZXC is surface mount, which enables dense component placement on PCBs.
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