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| Country of Origin | India |
|---|---|
| Voltage | 318V |
| Brand | Samtec |
| Orientation | Vertical |
| Current | 2.2A |
| Model | ERF8 |
| Mount Type | Surface |
| Housing Material | Liquid Crystal Polymer |
| Contact Material | Beryllium Copper Alloy |
| Series | ERF8 |
| Termination Type | Solder |
| Maximum Operating Temperature | 125°C |
| Sub Type | Board-to-Board |
| Minimum Operating Temperature | -55°C |
| Number of Rows | 2 |
| Pitch | 0.8mm |
| Contact Plating | Gold |
| Number of Contacts | 20 |
| Connector System | Board-to-Board |
| Stacking Height | 18mm |
| Row Pitch | 4.5mm |
The Samtec ERF8-010-05.0-S-DV-L-K-TR is an advanced vertical surface mount PCB socket specifically engineered for board-to-board interconnections in modern electronic assemblies. Designed with 20 gold-plated, beryllium copper contacts arranged in two rows at a 0.8 mm pitch, this connector maximizes density without compromising on electrical performance. The double-row format allows for secure signal or power transfer in compact spaces where reliable, durable connections are crucial.
Engineered to carry up to 2.2 amperes at 318 volts, the ERF8-010-05.0-S-DV-L-K-TR supports critical applications requiring both signal and moderate power routing. Its robust contacts, featuring gold plating for excellent corrosion resistance and signal integrity, guarantee long-lasting performance under a wide range of conditions.
The socket housing is manufactured from high-quality liquid crystal polymer, ensuring mechanical stability and tolerance to high temperatures. Its operational range spans -55°C to 125°C, enabling use in harsh environments found in industrial, laboratory, data processing, and advanced communication systems. The standard stacking height of 18 mm facilitates space-efficient PCB layouts while allowing for optimal airflow and service access.
This Samtec PCB socket is equipped with a secure solder termination optimized for surface mounting, simplifying the assembly process while providing excellent retention and alignment. The robust edge rate contact construction makes it ideal for high-speed board-to-board connections, supporting data rates up to 56Gbps PAM4 as required by modern signal integrity needs in networking, automation, and telecommunications.
Common applications include industrial controls, instrumentation, embedded computing systems, modular electronic designs, and anywhere compact, high-reliability board-to-board interfacing is demanded. The vertical orientation saves PCB footprint while ensuring efficient stacking and system integration. The connector’s compliance with demanding temperature and mechanical specifications makes it suitable for mission-critical electronics in automotive, aerospace, and industrial automation sectors.
Samtec's reputation for quality components backs the ERF8-010-05.0-S-DV-L-K-TR PCB socket as a preferred choice for engineers and system integrators seeking high density, high-speed, and rugged board-level interconnections.
Discover more advanced PCB Socket solutions and related interconnect technologies in the Electronics Components category, or browse additional Samtec products for compatible and complementary options.
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