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Samtec ERF8 Series Vertical Surface PCB Socket 10 Contacts 2 Row 0.8mm Pitch Solder

Category PCB Socket Brand Samtec Condition New

Specifications

Country of Origin India
Voltage 318V
Brand Samtec
Orientation Vertical
Current 2.2A
Model ERF8
Mount Type Surface
Housing Material Liquid Crystal Polymer
Contact Material Beryllium Copper Alloy
Series ERF8
Termination Type Solder
Maximum Operating Temperature 125°C
Sub Type Board-to-Board
Minimum Operating Temperature -55°C
Number of Rows 2
Pitch 0.8mm
Contact Plating Gold
Number of Contacts 10
Connector System Board-to-Board
Stacking Height 18mm
Row Pitch 4.5mm

Key Features

  • High-speed, edge rate contact system for secure board-to-board connectivity.
  • Vertical surface-mount PCB socket with 10 contacts and 2-row design.
  • 0.8 mm pitch enables high-density electronic assemblies.
  • Rated for 2.2A current and 318V voltage for industrial performance.
  • Liquid crystal polymer housing ensures durability and reliability.
  • Gold-plated beryllium copper alloy contacts provide conductive integrity.
  • Stacking height of 18 mm allows flexible multilayer board design.
  • Operates reliably in temperature range from -55°C to 125°C.

Product Description

Samtec ERF8-005-05.0-S-DV-K-TR is a high-performance vertical surface-mount PCB socket designed for advanced board-to-board electronic applications, featuring a 10-contact, 2-row configuration with a 0.8 mm pitch. This socket belongs to the ERF8 series, known for robust connectivity in high-speed systems.

The socket utilizes edge rate contact technology, providing secure and reliable signal transmission up to 56 Gbps PAM4. This makes it ideal for industrial, electronics, telecom, and laboratory settings where dependable, low-loss interconnections are critical.

The vertical orientation and surface-mount design facilitate compact and space-saving PCB layouts. With its 10 contacts arranged in two rows, this connector is suitable for devices requiring dense electronic assemblies, supporting both performance and miniaturization.

The pitch of 0.8 mm allows for close placement of contacts, maximizing board real estate and enabling advanced design flexibility. Rated for 2.2A current and 318V voltage, this socket meets the requirements of demanding industrial applications, ensuring reliable operation even under high electrical loads.

Durability is ensured by the use of liquid crystal polymer for the housing and gold-plated beryllium copper alloy for the contacts. These materials provide exceptional mechanical strength and corrosion resistance, delivering prolonged service life in harsh environments.

Stacking height of 18 mm offers designers flexibility to build multilayer boards and integrate complex system architectures. The socket supports a wide operating temperature range from -55°C to 125°C, making it suitable for laboratory instruments, industrial automation, telecommunications equipment, and high-end computing devices exposed to varied thermal conditions.

Solder termination type ensures robust connection to the PCB, minimizing signal loss and providing excellent reliability for ongoing operation. The board-to-board connector system is a preferred choice for constructing reliable assemblies in manufacturing, R&D, and commercial electronic products.

Typical applications for this socket include high-speed data transfer boards, modular electronic systems, advanced test equipment, and industrial control electronics. The ERF8-005-05.0-S-DV-K-TR enables compact, high-density assembly while maintaining superior performance and mechanical integrity.

Explore the complete Samtec PCB Socket range for options tailored to various design requirements and browse EnvMart for additional connectors, mounting accessories, and advanced electronic components.

Samtec ERF8 Series Vertical Surface PCB Socket 10 Contacts 2 Row 0.8mm Pitch Solder
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Frequently Asked Questions

The maximum voltage rating for this socket is 318V.

This model has a current rating of 2.2A.

The pitch size of the contacts is 0.8 mm, allowing for high-density electronic assemblies.

This vertical PCB socket features 10 contacts arranged in a 2-row configuration.

The housing is made from liquid crystal polymer, and the contacts are constructed from gold-plated beryllium copper alloy.

The stacking height of this socket is 18 mm, which allows for flexible multilayer board designs.

It operates reliably within a temperature range of -55°C to 125°C.

This socket uses a solder termination type for robust connection to the PCB.

Typical applications include high-speed data transfer boards, modular electronic systems, and industrial control electronics.

The orientation of this socket is vertical, facilitating compact PCB layouts.

This model is a board-to-board connector system, designed for secure interconnections.

This socket belongs to the ERF8 series, known for high-speed connectivity in electronic applications.

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