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Samtec Series Vertical Surface PCB Socket, Board-to-Board, 100 Contacts, 2 Rows, 0.8 mm Pitch, 2.2A Current, Liquid ERF8

Category PCB Socket Brand Samtec Condition New

Specifications

Country of Origin India
Voltage 318V
Brand Samtec
Orientation Vertical
Current 2.2A
Model ERF8
Mount Type Surface
Housing Material Liquid Crystal Polymer
Contact Material Beryllium Copper Alloy
Series ERF8
Termination Type Solder
Maximum Operating Temperature 125°C
Sub Type Board-to-Board
Minimum Operating Temperature -55°C
Number of Rows 2
Pitch 0.8mm
Contact Plating Gold
Number of Contacts 100
Connector System Board-to-Board
Stacking Height 18mm
Row Pitch 4.5mm

Key Features

  • Constructed with Liquid Crystal Polymer housing for high durability.
  • Gold-plated Beryllium Copper Alloy contacts provide excellent conductivity and corrosion resistance.
  • Surface mount design with vertical orientation suits compact PCB layouts.
  • Operates reliably between -55°C and 125°C temperature range.
  • Supports 318V voltage and features a stacking height of 18mm.
  • Row pitch measures 4.5mm ensuring proper connector spacing.
  • Termination method uses solder for secure connections.
  • Ideal for high-speed data transfer systems with up to 56Gbps PAM4 signaling performance.

Product Description

Samtec ERF8 Series Vertical Surface PCB Socket ERF8 is a specialized board-to-board socket designed for high-speed and high-density interconnections. It features 100 contacts arranged in 2 rows with a 0.8 mm pitch, supporting currents up to 2.2A and voltage rating of 318V, making it ideal for demanding electronic assemblies.

Constructed from durable Liquid Crystal Polymer housing material and gold-plated Beryllium Copper Alloy contacts, this surface mount socket ensures high reliability and excellent conductivity. Its vertical orientation and 18mm stacking height optimize space on printed circuit boards, supporting sophisticated designs without compromising performance.

The socket operates within a wide temperature range from -55°C to 125°C, suitable for harsh industrial environments. Its solder termination provides secure mechanical and electrical connections, essential for stable board-to-board interfacing.

With a 4.5mm row pitch and rugged edge rate contacts, the ERF8 socket facilitates reliable signal integrity, supporting transmission speeds up to 56Gbps PAM4. This makes it suitable for advanced communication and computing equipment requiring fast and stable data transfer.

This product is designed for use in industrial electronics, telecommunications, computing equipment, and other commercial applications demanding high-performance PCB sockets. Constructed with Liquid Crystal Polymer housing for durability and heat resistance.

Gold-plated Beryllium Copper Alloy contacts ensure superior conductivity and corrosion resistance. Surface mount, vertical orientation design optimizes PCB layout space. Supports operating temperatures from -55°C to 125°C for robust performance.

Rated for 2.2A current and 318V voltage applications. 100 contacts arranged in 2 rows with 0.8 mm pitch for high-density connection. Solder termination provides secure and reliable electrical contact. Stacking height of 18mm suits multi-board configurations.

Rugged edge rate contacts support signal integrity up to 56Gbps PAM4. Ideal for high-speed communications and industrial electronic systems. Explore the Samtec ERF8 range and other PCB Socket products for reliable electronic component solutions at EnvMart.

Samtec Series Vertical Surface PCB Socket, Board-to-Board, 100 Contacts, 2 Rows, 0.8 mm Pitch, 2.2A Current, Liquid ERF8
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Frequently Asked Questions

This model supports a maximum current of 2.2A.

The voltage rating for this socket is 318V.

It operates reliably within a temperature range of -55°C to 125°C.

This socket features 100 contacts arranged in 2 rows.

The pitch size of the contacts is 0.8 mm.

It uses solder termination for secure connections.

The stacking height is 18mm, suitable for multi-board configurations.

The housing is made from Liquid Crystal Polymer, and the contacts are gold-plated Beryllium Copper Alloy.

This model features a vertical orientation.

It is designed for use in industrial electronics, telecommunications, and computing equipment.

The row pitch measures 4.5mm, ensuring proper connector spacing.

It supports high-speed data transfer with signaling performance up to 56Gbps PAM4.

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