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| Country of Origin | India |
|---|---|
| Voltage | 318V |
| Brand | Samtec |
| Orientation | Vertical |
| Current | 2.2A |
| Model | ERF8 |
| Mount Type | Surface |
| Housing Material | Liquid Crystal Polymer |
| Contact Material | Beryllium Copper Alloy |
| Series | ERF8 |
| Termination Type | Solder |
| Maximum Operating Temperature | 125°C |
| Sub Type | Board-to-Board |
| Minimum Operating Temperature | -55°C |
| Number of Rows | 2 |
| Pitch | 0.8mm |
| Contact Plating | Gold |
| Number of Contacts | 100 |
| Connector System | Board-to-Board |
| Stacking Height | 18mm |
| Row Pitch | 4.5mm |
Samtec ERF8 Series Vertical Surface PCB Socket ERF8 is a specialized board-to-board socket designed for high-speed and high-density interconnections. It features 100 contacts arranged in 2 rows with a 0.8 mm pitch, supporting currents up to 2.2A and voltage rating of 318V, making it ideal for demanding electronic assemblies.
Constructed from durable Liquid Crystal Polymer housing material and gold-plated Beryllium Copper Alloy contacts, this surface mount socket ensures high reliability and excellent conductivity. Its vertical orientation and 18mm stacking height optimize space on printed circuit boards, supporting sophisticated designs without compromising performance.
The socket operates within a wide temperature range from -55°C to 125°C, suitable for harsh industrial environments. Its solder termination provides secure mechanical and electrical connections, essential for stable board-to-board interfacing.
With a 4.5mm row pitch and rugged edge rate contacts, the ERF8 socket facilitates reliable signal integrity, supporting transmission speeds up to 56Gbps PAM4. This makes it suitable for advanced communication and computing equipment requiring fast and stable data transfer.
This product is designed for use in industrial electronics, telecommunications, computing equipment, and other commercial applications demanding high-performance PCB sockets. Constructed with Liquid Crystal Polymer housing for durability and heat resistance.
Gold-plated Beryllium Copper Alloy contacts ensure superior conductivity and corrosion resistance. Surface mount, vertical orientation design optimizes PCB layout space. Supports operating temperatures from -55°C to 125°C for robust performance.
Rated for 2.2A current and 318V voltage applications. 100 contacts arranged in 2 rows with 0.8 mm pitch for high-density connection. Solder termination provides secure and reliable electrical contact. Stacking height of 18mm suits multi-board configurations.
Rugged edge rate contacts support signal integrity up to 56Gbps PAM4. Ideal for high-speed communications and industrial electronic systems. Explore the Samtec ERF8 range and other PCB Socket products for reliable electronic component solutions at EnvMart.
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