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Samtec ERF8 Series Vertical Surface PCB Socket, 60-Contact, 2 Row, 0.8 mm Pitch, 2.2A, 318V

Category PCB Socket Brand Samtec Condition New

Specifications

Country of Origin India
Voltage 318V
Brand Samtec
Orientation Vertical
Current 2.2A
Model ERF8
Mount Type Surface
Housing Material Liquid Crystal Polymer
Contact Material Beryllium Copper Alloy
Series ERF8
Termination Type Solder
Maximum Operating Temperature 125°C
Sub Type Board-to-Board
Minimum Operating Temperature -55°C
Number of Rows 2
Pitch 0.8mm
Contact Plating Gold
Number of Contacts 60
Connector System Board-to-Board
Stacking Height 18mm
Row Pitch 4.5mm

Key Features

  • Supports a current of 2.2 amperes and voltage rating of 318 volts.
  • Features surface mount termination with solder type connection.
  • Constructed with liquid crystal polymer housing material for durability.
  • Vertical orientation and stacking height of 18 mm ensure compact layout.
  • Contact material is beryllium copper alloy with gold plating for enhanced conductivity.
  • Operates within temperature range of -55°C to 125°C, suitable for harsh environments.
  • Connector system designed for board-to-board applications with 4.5 mm row pitch.

Product Description

Samtec ERF8 ERF8-030-07.0-L-DV-TR Vertical Surface PCB Socket is a precision-engineered electronic component designed for reliable, high-speed board-to-board connections. This 60-contact socket is arranged in 2 rows with a 0.8 mm pitch, enabling compact and efficient circuit designs. With a current capacity of 2.2 amperes and voltage rating up to 318 volts, it is suitable for demanding electronic applications.

Constructed from advanced liquid crystal polymer housing, this socket offers robust mechanical integrity and environmental resistance. The vertical orientation and 18 mm stacking height facilitate versatile PCB assembly configurations, ideal for industrial and commercial electronic equipment.

The contact terminals are made from beryllium copper alloy with gold plating, ensuring excellent conductivity and corrosion resistance for long-term reliability. Operating temperature range from -55°C to +125°C makes it suitable for extreme environmental conditions.

Typical use cases include high-speed data transmission systems, advanced computing hardware, telecommunications equipment, and industrial control systems. The solder termination type allows secure and stable PCB mounting, enhancing the structural and electrical performance of the assembly.

This ERF8 series socket supports 4.5 mm row pitch for optimal contact spacing in board-to-board connections. Current capacity of 2.2A with a voltage rating of 318V for robust electrical performance. Liquid crystal polymer housing provides durability under mechanical and thermal stress.

Gold plated beryllium copper alloy contacts ensure high electrical conductivity and minimal signal loss. Wide operating temperature range from -55°C to 125°C for versatile applications. Vertical surface mount design with 18 mm stacking height optimizes PCB space.

60 contacts arranged in 2 rows with 0.8 mm pitch for high-density interconnections. Suitable for industrial, telecommunications, and computing electronics. Explore more high-quality PCB Sockets and connectors in the Electronics & Electricals category at EnvMart for your assembly and design needs.

Samtec ERF8 Series Vertical Surface PCB Socket, 60-Contact, 2 Row, 0.8 mm Pitch, 2.2A, 318V
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Frequently Asked Questions

This model supports a current of 2.2 amperes and a voltage rating of 318 volts, making it suitable for demanding electronic applications.

The socket features a 0.8 mm pitch and has a total of 60 contacts arranged in 2 rows.

It utilizes a solder termination type for secure and stable PCB mounting.

The housing is made from liquid crystal polymer, while the contact terminals are constructed from beryllium copper alloy with gold plating for enhanced conductivity.

This model has a vertical orientation with a stacking height of 18 mm, optimizing PCB space for compact layouts.

It operates within a temperature range of -55°C to +125°C, making it suitable for harsh environments.

The row pitch for this socket is 4.5 mm, allowing for optimal contact spacing in board-to-board connections.

Typical use cases include high-speed data transmission systems, advanced computing hardware, telecommunications equipment, and industrial control systems.

The gold plating on the beryllium copper alloy contacts ensures excellent conductivity and corrosion resistance, contributing to long-term reliability.

The country of origin for this socket is India.

It is designed for board-to-board applications, facilitating reliable connections between PCBs.

This model has 2 rows, which allows for a compact design in electronic assemblies.

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