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TE Connectivity Z-PACK HM-Zd 2.5 mm Pitch Backplane Connector, Right Angle Female, 80 Contacts, 700mA Current 6469001-1

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TE Connectivity Z-PACK HM-Zd 2.5 mm Pitch Backplane Connector, Right Angle Female, 80 Contacts, 700mA Current 6469001-1

Name: TE Connectivity Z-PACK HM-Zd 2.5 mm Pitch Backplane Connector, Right Angle Female, 80 Contacts, 700mA Current 6469001-1
Brand: TE Connectivity
SKU: 338940
Price: 44.95 USD
Availability: InStock

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Category Backplane Connector Brand TE Connectivity Condition New

Specifications

Country of Origin	China
Voltage	250V ac
Brand	TE Connectivity
Orientation	Right Angle
Current	700mA
Mount Type	Through Hole
Housing Material	Polyethylene Terephthalate
Contact Material	Copper Nickel Silicon
Series	Z-PACK HM-Zd
Maximum Operating Temperature	105°C
Minimum Operating Temperature	-65°C
Number of Rows	8
Number of columns	10
Pitch	2.5mm
Contact Plating	Gold over Nickel
Number of Contacts	80
Contact Gender	Female
Connector Gender	Female

Key Features

Constructed with polyethylene terephthalate housing material for durability.
Capable of handling 700mA current at 250V AC voltage.
Contact material comprises copper nickel silicon with gold over nickel plating for excellent conductivity and corrosion resistance.
Designed for through-hole mount type ensuring secure PCB attachment.
Operates reliably from -65°C to 105°C temperature range.
Conforms to Z-PACK HM-Zd series specifications.
Produces a right angle orientation for compact PCB layouts.
Manufactured in China with high precision standards.

Product Description

TE Connectivity 6469001-1 Z-PACK HM-Zd 2.5 mm Pitch Backplane Connector is a right angle female connector assembly designed for industrial and electronic applications requiring robust backplane connections with 80 contact points arranged in a 10 column by 8 row matrix. It supports current up to 700mA and voltage of 250V AC, providing reliable electrical performance in demanding environments.

The connector features a durable polyethylene terephthalate housing material and copper nickel silicon contacts plated with gold over nickel, ensuring excellent conductivity and resistance to wear and corrosion. The through-hole mounting type facilitates secure attachment to PCBs, suitable for high-speed differential board-to-backplane interconnect solutions, including PICMG 3.x (ATCA) industry standards.

Designed to accommodate temperatures from -65°C to 105°C, it maintains performance under varying thermal conditions encountered in industrial, manufacturing, and electronics equipment. Its Z-PACK HM-Zd series classification confirms compliance with established industry connector standards, supporting speeds from 3 to 6.4 Gb/s differential signaling.

Polyethylene terephthalate housing material offering mechanical stability. Copper nickel silicon contact material with gold over nickel plating for enhanced durability. Right angle female orientation facilitates compact PCB design.

Through-hole mounting ensures robust mechanical connection. Wide temperature operating range suitable for industrial use. Supports high-speed differential data transmission.

This connector is ideal for industrial automation, telecommunication equipment, HVAC controls, and electronic manufacturing applications requiring reliable backplane connections. Manufactured in China, the product maintains consistent quality and precision engineering.

Explore extensive ranges of connectors and backplane components at EnvMart for efficient and durable connectivity solutions.