Samtec ESQT Series Vertical Through Hole PCB Socket 40-Contact 2 Row 2 mm Pitch Solder ESQT-120-02-L-D-750

Samtec ESQT-120-02-L-D-750 is a high-quality vertical through hole PCB socket from the ESQT series, featuring 40 contacts arranged in 2 rows with a 2 mm pitch. This board-to-board socket offers a solder termination type which ensures a reliable and durable mechanical and electrical connection for printed circuit boards.

The socket complies with PC/104-Plus standards, making it suitable for modular embedded systems. It is constructed with a housing made of black liquid crystal polymer, known for excellent electrical insulation and mechanical resistance in harsh operating environments.

Contact materials are made of phosphor bronze with a gold plating that enhances conductivity and resists corrosion. This connector supports a current capacity of 4.5 A and can withstand an operating temperature range from -55°C to +125°C, enabling use in a wide variety of industrial, electronic, and commercial applications.

The through hole mount type provides a robust and stable connection to the PCB with vertical orientation facilitating integration in board-to-board configurations. The FleXYZ design flexibility allows design adaptability across all three axes, supporting up to six rows with 50 pins per row, thus catering to complex connection requirements.

Flexible elevated socket strip compliant with PC/104-Plus standards. Durable liquid crystal polymer housing with black insulator material. Efficient gold-plated phosphor bronze contacts ensure signal integrity. Capable of handling 4.5 A current and wide temperature range operation.

Designed for vertical board-to-board connections with 2 mm pitch spacing. Through hole mount for secure PCB assembly. FleXYZ design provides multi-axis adaptability for complex layouts.

This PCB socket series is widely used in industrial electronics, embedded computing, telecommunications equipment, and anywhere robust, high-density connector solutions are required. It is an ideal choice for engineers developing compact and reliable board-to-board interconnect systems.

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