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Amphenol Communications Solutions Bergstik Series Through Hole Pin Header, 3 Contacts, 2.54 mm Pitch, 1 Row 77311-124-03LF
Specifications
| Country of Origin | France |
|---|---|
| Brand | Amphenol Communications Solutions |
| Current | 3A |
| Model | 77311-124-03LF |
| Mount Type | Through Hole |
| Contact Material | Phosphor Bronze |
| Termination Type | Solder |
| Number of Rows | 1 |
| Pitch | 2.54mm |
| Number of Contacts | 3 |
| Shrouded/Unshrouded | Unshrouded |
Key Features
- Features an unshrouded 1-row design for versatile connection applications.
- Constructed with phosphor bronze contact material to ensure durability and conductivity.
- Designed for through hole mounting with solder termination type for secure assembly.
- Supports current carrying capacity of 3A suited for various electronic devices.
- High temperature thermoplastic material ensures reliability under thermal stress.
- Compatible with reflow soldering processes for modern manufacturing workflows.
- Variable spacing height allows stacking headers to cater to different application needs.
- Offers dual entry mating from top or bottom for enhanced flexibility in mezzanine applications.
Product Description
Amphenol Communications Solutions 77311-124-03LF through hole pin header is a part of the Bergstik Series featuring 3 contacts, 1 row, and a 2.54 mm pitch. This unshrouded header is designed for board-to-board, wire-to-board, and cable-to-board interconnections in electronic equipment and devices.
Manufactured using phosphor bronze for contact parts, it delivers excellent conductivity and durability. The header body is made of high temperature thermoplastic material, allowing it to withstand demanding thermal environments.
Its through hole mount type with solder termination supports robust solder joints suitable for automated assembly and reflow soldering processes. With a current rating of 3A, it is optimized for reliable performance in various electronic applications.
The design allows variable stacking heights, making it suitable for mezzanine applications where different clearance requirements are essential. Dual entry mating capability from top or bottom provides flexibility in PCB design and assembly configurations.
Originating from France, this Amphenol Bergstik Series header is ideal for use in industrial electronics manufacturing, telecommunications, and commercial electronic assemblies. Unshrouded 1-row pin header with 3 contacts designed for through hole mounting.
Phosphor bronze contacts ensure durable electrical connections. Supports 3A current with 2.54 mm pitch spacing between pins. High temperature thermoplastic material body suitable for reflow soldering. Variable stacking height and dual entry mating enhance assembly flexibility.
Discover more quality connectors and PCB Headers suitable for diverse industrial and electronics applications in the Amphenol Communications Solutions range on EnvMart.
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Frequently Asked Questions
This model supports a current carrying capacity of 3A, making it suitable for various electronic devices.
The contact pitch of this through hole pin header is 2.54 mm, which is standard for many electronic applications.
It is designed for through hole mounting, allowing for secure assembly on printed circuit boards.
The contacts are constructed from phosphor bronze, ensuring good conductivity and durability.
This pin header features 3 contacts arranged in a single row.
It uses a solder termination type, which supports robust solder joints for secure connections.
Yes, it is compatible with reflow soldering processes, making it suitable for modern manufacturing workflows.
This model offers variable stacking heights, which cater to different application needs, particularly in mezzanine configurations.
Yes, it allows dual entry mating from both the top and bottom, enhancing flexibility in PCB design.
The pin header originates from France, indicating its place of manufacture.
It is ideal for board-to-board, wire-to-board, and cable-to-board interconnections in electronic equipment and devices.
The body is made from high temperature thermoplastic material, ensuring reliability under thermal stress.
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