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| Country of Origin | France |
|---|---|
| Brand | CIF |
| Length | 100mm |
| Model | ACP58 |
| Width | 580mm |
| Hole Diameter | 1mm |
| Standards/Approvals | DIN 41612 |
| Number of Sides | 1 |
| Hole Pitch | 2.54mm |
| Copper Thickness | 35μm |
CIF ACP58 single-sided matrix board with 1 mm holes and a pitch of 2.54 mm is engineered for precision electronic prototyping and secure laying out of electrical components. The board measures 100 mm in length and 580 mm in width, making it ideal for various circuit customization tasks.
The board is constructed using 15/10th tinned copper clad pads on a CEM 1 substrate, providing excellent conductivity and durability. The copper thickness is 35μm, ensuring reliable electrical connections throughout the prototyping process. Square pads of 2 mm on each side and a 0.54 mm gap across the surface offer superior component stability and ease of soldering.
Manufactured in France, this matrix board complies with DIN 41612 standards, reflecting high industrial quality benchmarks. This product is especially suitable for use as a pre-design tool, allowing engineers and technicians to customize circuit board fabrication efficiently.
Typical applications include laying out electrical components securely and serving as a foundational board for electronic systems development and testing in industrial, laboratory, and manufacturing environments.
15/10th tinned copper clad pads on CEM 1 substrate. Copper thickness of 35μm for enhanced electrical performance. Single-sided design with 1 mm holes and 2.54 mm pitch. Dimensions of 100 mm length and 580 mm width for versatile use.
Pads sized 2 mm square with 0.54 mm surface gap. DIN 41612 compliance ensures industrial quality standard. Manufactured in France, guaranteeing premium quality. Explore further in our Electronics Components range at EnvMart for broad selection of prototyping and Matrix Boards facilitating advanced electronic projects.
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