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TDK 220nF Multilayer Ceramic Capacitor 25V dc ±10% Tolerance Surface Mount CGA3E3X8R1E224K080AD

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TDK 220nF Multilayer Ceramic Capacitor 25V dc ±10% Tolerance Surface Mount CGA3E3X8R1E224K080AD

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Category Multilayer Ceramic Capacitor Brand TDK Condition New

Specifications

Country of Origin	Japan
Voltage	25V dc
Brand	TDK
Height	0.8mm
Length	1.6mm
Model	CGA3E3X8R1E224K080AD
Packaging	Tape & Reel
Width	0.8mm
Mount Type	Surface
Series	CGA
Termination Type	Surface Mount
Maximum Operating Temperature	150°C
Tolerance	±10 %
Capacitance	220nF
Minimum Operating Temperature	-55°C
Package/Case	0603
Dielectric	X8R
Automotive Standard	AEC-Q200
Suppression Class	Class II

Key Features

Constructed with AgPdCu termination for enhanced conductive glue mounting performance.
Designed to reduce the risk of silver migration, improving reliability.
Improved mechanical and thermal strength optimised for conductive glue use.
Compact 0603 package size with dimensions 1.6 mm length, 0.8 mm width, and 0.8 mm height.
Compliant with automotive standard AEC-Q200, suitable for harsh environments.
Operates reliably within temperature range from -55°C to 150°C maximum.
Surface mount termination type designed for SMT assembly processes.
Suppression Class II capacitor suitable for automotive and industrial applications.

Product Description

TDK CGA3E3X8R1E224K080AD is a multilayer ceramic capacitor (MLCC) designed for surface mount technology (SMT) assembly and automotive use, offering 220nF capacitance at 25V dc with ±10% tolerance. Featuring an X8R dielectric, this Class II capacitor provides stable performance across a wide temperature range of -55°C to 150°C, making it suitable for harsh automotive and industrial environments.

Its AgPdCu termination enhances mechanical and thermal robustness, reducing silver migration risk when mounted with conductive glue. The compact 0603 package (1.6 mm × 0.8 mm × 0.8 mm) optimises PCB space while maintaining electrical integrity.

This capacitor complies with the automotive standard AEC-Q200, ensuring reliability in transmission control units, engine sensor modules, ABS systems, and a variety of powertrain applications. Its design is tailored for applications needing conductive glue mounting, combining durability with compact size.

Constructed with AgPdCu termination for improved conductive glue mounting. Minimizes silver migration risk, enhancing product reliability. High mechanical and thermal strength for automotive-grade applications. Compact 0603 package size measuring 1.6 mm length by 0.8 mm width and height.

Approved to automotive standard AEC-Q200 for harsh environment suitability. Operational temperature range from -55°C to 150°C ensures versatility. Surface mount termination ideal for SMT assembly methods. Class II suppression suitable for automotive and industrial electronics.

Applications include transmission control, engine sensors, and automotive powertrain ABS.

Country of origin is Japan, reflecting TDK’s commitment to quality manufacturing standards. This MLCC is ideal for industrial, automotive, and electronic manufacturing sectors where reliability and performance are paramount.

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