$7.85
$7.62
Tax included
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| Country of Origin | India |
|---|---|
| Voltage | 100V |
| Brand | E-TEC |
| Orientation | Vertical |
| Current | 1A |
| Frame Type | Open Frame |
| Length | 25.4mm |
| Model | LOP-320-S083-95 |
| Depth | 10.16mm |
| Width | 2.41mm |
| Mount Type | Through Hole |
| Housing Material | Polybutylene Terephthalate |
| Contact Material | Beryllium Copper Alloy |
| Series | LOP/SLP |
| Termination Type | Solder |
| Maximum Operating Temperature | 125°C |
| Pitch | 2.54mm |
| Contact Plating | Tin, Gold |
| Number of Contacts | 20 |
| Pin Type | Turned |
| Row Width | 7.62mm |
E-TEC LOP-320-S083-95 20 Way Through Hole Turned Pin Open Frame DIL Socket features a vertical orientation and 2.54 mm pitch designed for precise and reliable connections in electronics assembly. This socket is specifically engineered to support up to 1A current at 100V, enabling safe operation in various industrial and laboratory electronic equipment.
The socket incorporates 20 contact points made from a beryllium copper alloy, enhanced with tin and gold plating to guarantee excellent contact conductivity and corrosion resistance. Its open frame design with polybutylene terephthalate housing provides mechanical stability while allowing proper heat dissipation during operation, maintaining performance at temperatures up to 125°C.
Measuring 25.4 mm in length, 10.16 mm in depth, and 2.41 mm in width, this compact DIL socket has a row width of 7.62 mm, enabling installation in tightly spaced PCBs and memory modules. The through hole mounting and solder termination types assure secure attachment for reliable long-term use in assembly lines and maintenance environments.
These features make it an excellent choice for industrial electronics manufacturing, telecommunications hardware, embedded systems, and laboratory instrumentation where robust, low-profile, and high-quality socket solutions are required.
Features 20 contacts for versatile electrical interface. Turned pins and open frame construction enhance signal integrity and durability. Gold and tin plating optimize electrical contact performance. Polybutylene terephthalate housing ensures insulation and strength.
Compatible with standard PCB hole diameter of 0.8 mm.
The E-TEC LOP/SLP series sockets are well suited for memory and IC packaging requiring minimal vertical stack height. Their design supports juxtaposition without throughput loss, facilitating compact and efficient PCB layouts. For additional design integration, 3D models and technical drawings can be sourced via DesignSpark software.
Explore the Electronics Components category at EnvMart for similar DIL Sockets and complementary connectors designed for diverse industrial and laboratory applications.
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