Samtec ERF5 Series Right Angle Surface PCB Socket 20-Contact 2 Row 0.5 mm Pitch Solder ERF5

Samtec ERF5 Series Right Angle Surface PCB Socket model ERF5 delivers a 20-contact, 2-row board-to-board connection solution with a fine 0.5 mm pitch solder termination. Designed for surface mounting, this connector utilizes a liquid crystal polymer housing material that ensures durability and reliability under industrial and electronic applications.

The ERF5 series is engineered to meet demanding electrical performance requirements, supporting currents up to 1.6 A and voltages reaching 194 V. Its contacts are crafted from beryllium copper alloy with gold plating, providing optimal electrical conductivity and corrosion resistance, enhancing lifecycle and durability.

This PCB socket features a right angle orientation with a stacking height of 12 mm, enabling flexible mating heights from 7 mm to 12 mm when combined with corresponding board-to-board headers from the ERM5 series. It is ideally suited for high-speed applications, achieving data rates up to 28 Gbit/s via its Edge Rate contact design that minimizes crosstalk and signal degradation.

The ruggedized Edge Rate contacts feature a smooth milled surface that reduces contact wear and minimizes insertion and withdrawal forces, enabling zipping when unmating and contributing to extended connector life.

Operating temperatures from -55°C to 125°C make it reliable for use in harsh environments including industrial, manufacturing, telecommunications, and laboratory equipment.

This connector series is commonly applied in electronic devices requiring compact, reliable, high-speed board-to-board connections with a secure solder mount and right angle design, making it suitable for a wide range of industrial and electronic component assemblies.

Features 20-contact design arranged in 2 rows for reliable connections. Pitch of 0.5 mm suitable for high-density PCB applications. Constructed with a liquid crystal polymer housing for durability. Right angle orientation facilitates surface mounting on PCBs.

Rated for 1.6 A current and 194 V voltage handling. Contact material uses beryllium copper alloy with gold plating for excellent conductivity and longevity. Stacking height of 12 mm allows flexible mating heights from 7 mm to 12 mm.

Operating temperature range from -55°C to 125°C supports harsh environments. Designed for high-speed data transfer up to 28 Gbit/s with Edge Rate contacts. Ruggedized contacts reduce insertion/withdrawal forces and prevent wear.

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