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Samtec ERF8 Series Vertical Surface PCB Socket 26-Contact 2 Row 0.8 mm Pitch Solder ERF8
Specifications
| Country of Origin | India |
|---|---|
| Voltage | 318V |
| Brand | Samtec |
| Orientation | Vertical |
| Current | 2.2A |
| Model | ERF8 |
| Mount Type | Surface |
| Housing Material | Liquid Crystal Polymer |
| Contact Material | Beryllium Copper Alloy |
| Series | ERF8 |
| Termination Type | Solder |
| Maximum Operating Temperature | 125°C |
| Sub Type | Board-to-Board |
| Minimum Operating Temperature | -55°C |
| Number of Rows | 2 |
| Pitch | 0.8mm |
| Contact Plating | Gold |
| Number of Contacts | 26 |
| Connector System | Board-to-Board |
| Stacking Height | 18mm |
| Row Pitch | 4.5mm |
Key Features
- Compatible with vertical PCB surface mounting requirements.
- Supports current up to 2.2A ensuring reliable electrical performance.
- Made from Liquid Crystal Polymer housing for durability and performance.
- Offers a stacking height of 18 mm with 4.5 mm row pitch for compact designs.
- Contact made of Beryllium Copper Alloy plated with gold for enhanced conductivity and corrosion resistance.
- Designed for operating voltage of 318V and supports operating temperatures from -55°C to 125°C.
- Termination type is solder, ensuring strong mechanical and electrical connection.
- Connector system is board-to-board with vertical orientation for space-saving configurations.
Product Description
Samtec ERF8 Series Vertical Surface PCB Socket ERF8 is a high-performance board-mounted socket designed for vertical mounting on printed circuit boards. It features 26 contacts arranged in 2 rows with a fine pitch of 0.8 mm. The socket supports a maximum current rating of 2.2A and an operating voltage of 318V, making it suitable for demanding electronic applications.
The housing is made from Liquid Crystal Polymer, providing mechanical strength and thermal stability across a wide temperature range from -55°C to 125°C. Contacts are crafted from Beryllium Copper Alloy and plated with gold to ensure excellent conductivity and resistance to corrosion.
The product is designed for surface mount technology (SMT) with a vertical orientation, enabling compact and efficient board-to-board interconnections. It has a stacking height of 18 mm and a row pitch of 4.5 mm, optimizing space utilization in electronic assemblies.
Ideal for industrial, communications, and high-speed computing applications, this PCB socket supports up to 56Gbps PAM4 signaling, making it suitable for cutting-edge data transfer systems and advanced electronic devices.
Compatible with vertical PCB surface mounting requirements. Supports current up to 2.2A ensuring reliable electrical performance. Made from Liquid Crystal Polymer housing for durability and performance. Offers a stacking height of 18 mm with 4.5 mm row pitch for compact designs.
Contact made of Beryllium Copper Alloy plated with gold for enhanced conductivity and corrosion resistance. Designed for operating voltage of 318V and supports operating temperatures from -55°C to 125°C. Termination type is solder, ensuring strong mechanical and electrical connection.
Connector system is board-to-board with vertical orientation for space-saving configurations. Series ERF8 is engineered for high-speed systems with performance of 56Gbps PAM4 signaling.
Explore the Samtec PCB Socket series on EnvMart for advanced electronic components suited to various industry sectors including industrial automation, telecommunications, data centers, and consumer electronics.
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Frequently Asked Questions
The maximum current rating is 2.2A, ensuring reliable electrical performance in applications.
It is designed for an operating voltage of 318V, suitable for various electronic applications.
The housing is made from Liquid Crystal Polymer, and the contacts are made from Beryllium Copper Alloy plated with gold for enhanced conductivity and corrosion resistance.
The stacking height of this socket is 18 mm, allowing for compact designs in electronic assemblies.
This model features 26 contacts arranged in 2 rows, with a pitch of 0.8 mm.
It supports operating temperatures from -55°C to 125°C, making it suitable for a wide range of applications.
The termination type is solder, ensuring a strong mechanical and electrical connection.
It is designed for vertical orientation, which allows for space-saving configurations on printed circuit boards.
The row pitch is 4.5 mm, optimizing space utilization in electronic assemblies.
The connector system is board-to-board, facilitating efficient interconnections between circuit boards.
The country of origin for this product is India.
It is ideal for industrial, communications, and high-speed computing applications, supporting up to 56Gbps PAM4 signaling.
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