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Samtec ERF5 Series Straight Surface PCB Socket, 80-Contact, 2 Row, 0.5 mm Pitch, Solder Termination

Category PCB Socket Brand Samtec Condition New

Specifications

Country of Origin India
Voltage 194V
Brand Samtec
Orientation Straight
Current 1.6A
Model ERF5
Mount Type Surface
Housing Material Liquid Crystal Polymer
Contact Material Beryllium Copper Alloy
Series ERF5
Termination Type Solder
Maximum Operating Temperature 125°C
Sub Type Board-to-Board
Minimum Operating Temperature -55°C
Number of Rows 2
Pitch 0.5mm
Contact Plating Gold
Number of Contacts 80
Connector System Board-to-Board
Stacking Height 12mm

Key Features

  • Features 80 solder termination contacts arranged in 2 rows.
  • Utilizes 0.5 mm pitch for high-density PCB connections.
  • Constructed with beryllium copper alloy contacts and gold plating for durable conductivity.
  • Housing made from liquid crystal polymer ensuring thermal resistance.
  • Operates reliably between -55°C to 125°C temperature range.
  • Supports a current rating of 1.6A and voltage of 194V.
  • Surface mount type with straight orientation suitable for high-speed SMT applications.
  • Stacking height of 12 mm enables flexible mating configurations.

Product Description

Samtec ERF5 ERF5-040-07.0-L-DV-K-TR Straight Surface PCB Socket is a precision-engineered electronic connector designed for high-speed board-to-board applications. Featuring 80 contacts in 2 rows with a fine 0.5 mm pitch, this socket offers excellent signal integrity and electrical performance for advanced electronic systems.

The contact material is beryllium copper alloy plated with gold, providing high conductivity and durability, while the housing is constructed from liquid crystal polymer for enhanced thermal stability. The socket supports current up to 1.6A and voltage of 194V, ensuring reliability in demanding electrical environments.

Operating temperature ranges from -55°C to 125°C, making it suitable for industrial, telecommunications, and computing hardware. The surface mount straight orientation and 12 mm stacking height allow compatibility with mating ERM5 series headers to achieve various board-to-board height configurations.

These sockets incorporate ruggedized Edge Rate contacts with a milled surface designed to reduce insertion and withdrawal forces, extend life cycle, and maintain consistent high-speed performance up to 28 Gbit/s. This design minimizes crosstalk and broadside coupling, enhancing overall signal quality in high-frequency circuits.

The ERF5 series socket connectors are ideal for applications in electronic assemblies requiring reliable, high-speed interconnections such as telecommunications equipment, data centers, and industrial communications. Combining robust mechanical design with electrical precision, this product supports advanced manufacturing and electronic testing environments.

Features 80 solder termination contacts arranged in 2 rows. Utilizes 0.5 mm pitch for high-density PCB connections. Constructed with beryllium copper alloy contacts and gold plating for durable conductivity. Housing made from liquid crystal polymer ensuring thermal resistance.

Operates reliably between -55°C to 125°C temperature range. Supports a current rating of 1.6A and voltage of 194V. Surface mount type with straight orientation suitable for high-speed SMT applications. Stacking height of 12 mm enables flexible mating configurations.

Designed for board-to-board connector system with robust Edge Rate contacts reducing contact wear. Explore more about electronic connectors, or browse the Samtec brand for high-quality PCB interconnect solutions on EnvMart.

Samtec ERF5 Series Straight Surface PCB Socket, 80-Contact, 2 Row, 0.5 mm Pitch, Solder Termination
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Frequently Asked Questions

This model supports a current rating of 1.6A and a voltage rating of 194V.

It operates reliably between -55°C to 125°C, making it suitable for various demanding environments.

The socket features 80 solder termination contacts arranged in 2 rows.

This model utilizes a 0.5 mm pitch for high-density PCB connections.

The contacts are made from beryllium copper alloy and are gold plated, while the housing is constructed from liquid crystal polymer.

The stacking height is 12 mm, allowing for flexible mating configurations with headers.

It uses solder termination, which is standard for secure connections in electronic assemblies.

Yes, it is designed for high-speed SMT applications and can maintain consistent performance up to 28 Gbit/s.

The socket has a straight orientation, which is suitable for surface mount applications.

It is part of a board-to-board connector system, designed for reliable interconnections in electronic assemblies.

This socket is ideal for telecommunications equipment, data centers, and industrial communications requiring high-speed interconnections.

The country of origin for this product is India.

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