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| Country of Origin | China |
|---|---|
| Voltage | 250V ac |
| Brand | TE Connectivity |
| Orientation | Right Angle |
| Current | 700mA |
| Mount Type | Through Hole |
| Housing Material | Polyethylene Terephthalate |
| Contact Material | Copper Nickel Silicon |
| Series | Z-PACK HM-Zd |
| Maximum Operating Temperature | 105°C |
| Minimum Operating Temperature | -65°C |
| Number of Rows | 8 |
| Number of columns | 10 |
| Pitch | 2.5mm |
| Contact Plating | Gold over Nickel |
| Number of Contacts | 80 |
| Contact Gender | Female |
| Connector Gender | Female |
TE Connectivity presents the 6469001-1 Z-PACK HM-Zd 2.5mm pitch backplane connector, a right angle female connector featuring 80 contacts arranged in 10 columns and 8 rows. It is engineered for robust and high-speed differential board-to-backplane connections, making it ideal for industrial, telecommunications, computing, and data communication systems.
This Backplane Connector is constructed with a durable polyethylene terephthalate housing and copper nickel silicon contacts plated with gold over nickel to ensure signal integrity and resistance to corrosion. The through-hole mounting type ensures secure attachment to PCBs, suitable for press-fit applications.
Rated for 700mA current and 250V AC voltage, it operates reliably within a temperature range of -65°C to 105°C, making it suitable for industrial environments with varying thermal conditions. The connector complies with PICMG 3.x (ATCA) standards, providing a high-speed differential solution with data rates from 3 to 6.4 Gb/s, supporting modern communication and networking equipment.
The Z-PACK HM-Zd series is designed as a two-part system facilitating secure, efficient interconnection between daughterboards and backplanes. Its 2.5mm centerline pitch optimizes dense PCB layouts without sacrificing performance.
The connector features a 2.5mm pitch suitable for compact PCB designs. It supports current up to 700mA and voltage rating of 250V AC. Constructed with polyethylene terephthalate housing for enhanced durability. Gold over nickel plating ensures excellent contact corrosion resistance.
Designed for through-hole mounting to provide secure PCB attachment. Operating temperature ranges from -65°C to 105°C ensuring performance in harsh environments. Compatible with PICMG 3.x (ATCA) industry standards for backplane interconnections.
Provides differential signal solutions supporting 3 to 6.4 Gb/s data rates. Connector assembly is press-fit for straightforward board integration. Manufactured in China with a proven Z-PACK HM-Zd series heritage.
Suitable for use in industrial, telecommunications, computing, networking, and high-reliability applications requiring secure backplane connections. This connector is supplied in a tube, facilitating efficient assembly line processes. Explore the extensive range of connectors at EnvMart for comprehensive electronic component solutions.
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