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TE Connectivity Z-PACK HM-Zd 2.5 mm Pitch Backplane Connector Straight Male 10 Column 3 Row 60 Way 6469083-1

Category Backplane Connector Brand TE Connectivity Condition New

Specifications

Country of Origin China
Voltage 250V ac
Brand TE Connectivity
Orientation Straight
Current 700mA
Mount Type Board
Housing Material Polyethylene Terephthalate
Contact Material Phosphor Bronze
Series Z-PACK HM-Zd
Termination Type Solder
Maximum Operating Temperature 105°C
Minimum Operating Temperature -65°C
Number of Rows 3
Number of columns 10
Pitch 2.5mm
Contact Plating Tin over Nickel
Number of Contacts 60
Contact Gender Male
Connector Gender Male

Key Features

  • Supports a current rating of 700mA suitable for medium power applications.
  • Features a 10 column by 3 row configuration optimizing connector density.
  • Made from durable polyethylene terephthalate housing with phosphor bronze contacts.
  • Contact plating includes tin over nickel for enhanced corrosion resistance.
  • Rated for 250V AC voltage and operating temperatures from -65°C to 105°C.
  • Designed for board mounting with solder termination type ensuring secure installation.
  • Complies with PICMG 3.x industry standards for backplane connectors.

Product Description

TE Connectivity 6469083-1 Z-PACK HM-Zd backplane connector features a 2.5 mm pitch with a straight male orientation and 60 contacts arranged in 10 columns and 3 rows. This connector is engineered with a polyethylene terephthalate housing and phosphor bronze contact material plating with tin over nickel, providing reliable electrical and mechanical performance.

Rated for a current of 700mA and operating voltage of 250V AC, it supports operating temperatures ranging from -65°C to 105°C, ensuring functionality across harsh industrial and electronic environments.

The Z-PACK HM-Zd series is designed specifically for high-speed, differential board-to-backplane connections following PICMG 3.x (ATCA) industry standards, providing a differential solution for data rates in the 3 to 6.4 Gb/s range. The connector employs a board mounting type with solder termination, ensuring robust and durable attachment for critical backplane applications.

This connector is ideal for use in industrial electronics, telecommunications, data communications, manufacturing equipment, and embedded computing platforms requiring high-performance backplane interconnects.

Supports a current rating of 700mA suitable for medium power applications. Features a 10 column by 3 row configuration optimizing connector density. Made from durable polyethylene terephthalate housing with phosphor bronze contacts.

Contact plating includes tin over nickel for enhanced corrosion resistance. Rated for 250V AC voltage and operating temperatures ranging from -65°C to 105°C. Designed for board mounting with solder termination type ensuring secure installation.

Ensures compliance with PICMG 3.x industry standards for backplane connectors.

Package is supplied in a tube, facilitating ease of insertion into machinery and production lines, enhancing manufacturing efficiency. The connector is manufactured in China. Explore more in the Backplane Connectors category for complementary interconnect solutions.

TE Connectivity Z-PACK HM-Zd 2.5 mm Pitch Backplane Connector Straight Male 10 Column 3 Row 60 Way 6469083-1
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