TE Connectivity Backplane Connector Z-PACK HM-Zd 2.5 mm Pitch, Straight Male, 10 Column, 8 Row, 80 Way 6469002-1

TE Connectivity 6469002-1 Backplane Connector is a part of the Z-PACK HM-Zd series with a 2.5 mm pitch and features straight male connectors arranged in 10 columns and 8 rows totaling 80 contacts. This connector is engineered to deliver high reliability with a current rating of 7A and voltage capacity up to 250V, making it suitable for a variety of electronic applications requiring robust backplane connections.

The housing is constructed from polyethylene terephthalate, ensuring durable mechanical and thermal performance. Contacts are fabricated from phosphor bronze and plated with gold over nickel to provide excellent conductivity and corrosion resistance. This connector uses a press-in termination type and a through hole mount design, enabling secure and stable PCB installation.

Operating temperature ranges from -65°C minimum to 105°C maximum allow this connector to withstand harsh industrial environments. While the connector has no explicit standards or approvals listed, it complies with PICMG 3.x (ATCA) standards, making it an industry-accepted backplane interconnect solution.

This backplane connector supports high-speed differential signaling for data rates in the range of 3 to 6.4 Gb/s, ensuring performance suited for telecommunications, industrial computing, and data transport applications. The two-part Z-PACK HM-Zd system facilitates reliable mechanical and electrical connections between daughterboards and motherboards or backplanes, enhancing modularity and serviceability.

This backplane connector supports a current rating of 7A and voltage up to 250V. It features polyethylene terephthalate housing for robustness and durability. Phosphor bronze contacts with gold over nickel plating provide excellent conductivity.

Press-in termination and through hole mount type ensure secure attachment to PCBs. Operating temperature range is from -65°C to 105°C, accommodating harsh conditions. Designed for high-speed differential signals with data rates up to 6.4 Gb/s.

Compatible with PICMG 3.x (ATCA) standards for backplane interconnects. Z-PACK system design allows connection of daughterboards to motherboards with press fit mounting.

This connector is ideal for use in industrial, telecommunications, computing, and high-performance electronic equipment requiring reliable backplane connectivity. Its design supports efficient, stable communications in complex electronic assemblies.

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