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| Country of Origin | United Kingdom |
|---|---|
| Brand | RS PRO |
| Model | 110-2545 |
| Sub Type | Mother Board |
| External Height | 128.6mm |
| Pitch | 20.32mm |
| Board Material | Epoxy Glass Fabric Laminate |
| Standards/Approvals | BS 9762, RoHS, UL |
| Number of Contacts | 96 |
| Horizontal Pitch | 18.8HP |
| Number of Sides | 2 |
| Board Thickness | 1.6mm |
| Copper Thickness | 35μm |
RS PRO 110-2545 is a 96 way backplane constructed from epoxy glass fabric laminate. This double-sided mother board features an 18.8 HP horizontal pitch and a connector pitch of 20.32 mm, making it suitable for high-density electronic component interfacing.
The board has a copper thickness of 35 microns and a board thickness of 1.6 mm, with an external height of 128.6 mm. Its construction complies with key standards including BS 9762, RoHS, and UL, ensuring reliable quality and regulatory compliance.
Designed with complete flexibility, this backplane supports positioning of Vdc or earthing lines and offers four voltage lines. Power supply connections can be made via 6.3 mm terminal type faston or M3 threaded options. The design incorporates options to reduce crosstalk by using row b as a 0 V reserve line, enhancing signal clarity on rows a and c.
Edge connector fingers are gold plated to 1.5 microns thickness, improving connectivity and preventing corrosion. The board's microboard pattern includes a colander ground plane and solder mask protection to facilitate glitch-free high-speed operation and maximize screening effectiveness.
This product is ideal for applications in industrial electronics, PCB prototyping, PC/VME bus boards, and other manufacturing or development environments requiring high-quality Backplane Connectors.
Constructed with epoxy glass fabric laminate for durability and electrical insulation. Double-sided mother board with 96 contacts for extensive connections. Copper thickness of 35 microns and board thickness of 1.6 mm. Horizontal pitch of 18.8 HP and connector pitch of 20.32 mm for high-density interface.
Compliant with BS 9762, RoHS, and UL standards. Flexible power supply connection options with faston or M3 thread terminals. Design features to minimize crosstalk, improving signal integrity. Gold plated edge connector fingers of 1.5 microns thickness.
Microboard pattern includes colander ground plane and solder mask protection. Suitable for industrial, prototyping, manufacturing, and electronics applications. Explore more products in the Backplanes & Motherboards category at EnvMart for comprehensive electronics component solutions.
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