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| Country of Origin | United States |
|---|---|
| Voltage | 1kV |
| Brand | Aries Electronics |
| Orientation | Straight |
| Current | 1A |
| Housing Material | Polyphenylene Sulphide |
| Contact Material | Beryllium Copper Alloy |
| Series | 55 |
| Termination Type | Solder |
| Life | 25000 cycles |
| Maximum Operating Temperature | 105°C |
| Package Type | DIP |
| Minimum Operating Temperature | -55°C |
| Number of Rows | 2 |
| Pitch | 2.54mm |
| Contact Plating | Tin over Nickel |
| Number of Contacts | 24 |
| Row Pitch | 15.24mm |
| IC Socket Type | Test Socket |
| Socket Mount Type | Through Hole |
| Aries Electronics 2.54 mm Pitch 24 Way DIP Through Hole Test IC SocketBrand | Aries Electronics |
Aries Electronics 24-6554-10 2.54 mm Pitch 24 Way DIP Through Hole Test IC Socket is engineered for precision testing of integrated circuit devices with a standardized pitch of 2.54 mm and 24 contacts arranged in 2 rows. This IC test socket features a universal Zero Insertion Force (ZIF) mechanism accommodating devices of widths 0.3, 0.4, or 0.6 inches on a 0.1 inch pitch, with pin widths ranging from 0.015 to 0.045 inches.
The socket's electrical contacts are made from a beryllium copper alloy, plated with tin over nickel to optimize electrical conductivity and resist corrosion. Designed for through-hole mounting, it comes with solder tail pins facilitating secure PCB integration. Operating temperature spans from -55°C to +105°C, supporting diverse industrial, laboratory, and electronics manufacturing applications.
This test socket supports up to 1A current and withstands a breakdown voltage of 1000 Vac minimum. Its housing material is robust polyphenylene sulphide, offering excellent mechanical strength and thermal endurance, making it suitable for repeated use during testing cycles. The socket life expectancy is rated at 25000 cycles, indicating high durability for continuous operation in quality assurance and component validation environments.
The straight orientation and 15.24 mm row pitch are optimized for compatibility with standard DIP packages. This Aries Electronics test IC socket can be employed effectively in electronics assembly lines, laboratories, R&D facilities, and manufacturing environments requiring reliable, repeatable IC testing.
The socket features a universal ZIF mechanism suitable for devices of 0.3, 0.4, or 0.6 inch width on 0.1 inch pitch. Contact material is beryllium copper alloy with tin over nickel plating for enhanced conductivity and durability.
Supports operating temperature range from -55°C to 105°C for extended application environments. The socket is designed for through hole mounting with solder tail pins and a row pitch of 15.24 mm. Capable of handling up to 1A current and rated for a breakdown voltage of 1000 Vac minimum.
Housing is constructed from polyphenylene sulphide, ensuring mechanical strength and thermal resistance. Designed for long life of 25000 cycles, providing high reliability for repeated testing scenarios. Orientation is straight and termination type is solder suitable for printed circuit board integration.
Ideal for electronics manufacturing, laboratory testing, and industrial applications, this Aries Electronics test IC socket supports efficient device interfacing and functional verification. Explore more IC Sockets and electronic components with EnvMart for reliable solutions.
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