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Samtec ERF8 Series Vertical Surface PCB Socket 26-Contact 2 Row 0.8 mm Pitch Solder ERF8

Category PCB Socket Brand Samtec Condition New

Specifications

Country of Origin India
Voltage 318V
Brand Samtec
Orientation Vertical
Current 2.2A
Model ERF8
Mount Type Surface
Housing Material Liquid Crystal Polymer
Contact Material Beryllium Copper Alloy
Series ERF8
Termination Type Solder
Maximum Operating Temperature 125°C
Sub Type Board-to-Board
Minimum Operating Temperature -55°C
Number of Rows 2
Pitch 0.8mm
Contact Plating Gold
Number of Contacts 26
Connector System Board-to-Board
Stacking Height 18mm
Row Pitch 4.5mm

Key Features

  • Supports 26 electrical contacts arranged in 2 rows for reliable connections.
  • 0.8 mm pitch ensures compact and precise component placement.
  • Constructed with liquid crystal polymer housing for durability and performance.
  • Vertical orientation suited for surface mounting on PCBs.
  • Supports current rating of 2.2 A and voltage rating of 318 V.
  • Operating temperature ranges from -55°C to 125°C for extended application environments.
  • Stacking height of 18 mm provides suitable connector spacing.
  • Beryllium copper alloy contacts plated with gold for excellent conductivity and corrosion resistance.

Product Description

Samtec ERF8 Series vertical surface PCB socket ERF8 delivers robust electrical performance with 26 contacts configured in 2 rows and a 0.8 mm pitch solder termination, ideal for high-speed PCB interconnections.

Constructed with a liquid crystal polymer housing, this connector supports surface mount technology with a vertical orientation and stacking height of 18 mm, enabling compact and reliable board-to-board connections.

The socket supports a current rating of 2.2 A and voltage rating of 318 V, suitable for demanding electronic applications within industrial, telecommunications, computing, and high-speed data systems.

Operating temperature range spans from -55°C to 125°C, ensuring durability across diverse environments. Contacts are fabricated from beryllium copper alloy and plated with gold, providing superior electrical conductivity and corrosion resistance for long-term reliability.

This connector is engineered to support up to 56 Gbps PAM4 signaling performance for next-generation high-speed system designs.

Applications include industrial electronics, telecommunications infrastructure, high-speed computing, and other environments requiring robust, high-density board-to-board connectors. The product supports solder termination and complies with typical electronic component standards without special approvals noted.

Supports 26 electrical contacts arranged in 2 rows for reliable connections. 0.8 mm pitch ensures compact and precise component placement. Constructed with liquid crystal polymer housing for durability and performance. Vertical orientation suited for surface mounting on PCBs.

Supports current rating of 2.2 A and voltage rating of 318 V. Operating temperature ranges from -55°C to 125°C for extended application environments. Stacking height of 18 mm provides suitable connector spacing. Beryllium copper alloy contacts plated with gold for excellent conductivity and corrosion resistance.

Designed for high-speed data transfer systems featuring 56 Gbps PAM4 performance. Explore our comprehensive category for PCB Sockets and Samtec connectors at EnvMart for compatible industrial and electronics solutions.

Samtec ERF8 Series Vertical Surface PCB Socket 26-Contact 2 Row 0.8 mm Pitch Solder ERF8
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Frequently Asked Questions

This model supports a maximum current rating of 2.2 A.

The voltage rating for this connector is 318 V.

It operates within a temperature range of -55°C to 125°C.

This socket features 26 electrical contacts arranged in 2 rows.

It uses solder termination for connections.

The contacts are made from beryllium copper alloy and plated with gold for conductivity and corrosion resistance.

The stacking height is 18 mm, allowing for suitable connector spacing.

It is constructed with liquid crystal polymer housing.

The pitch of the contacts is 0.8 mm, ensuring compact placement.

It is designed for high-speed data transfer systems and applications in industrial electronics, telecommunications, and high-speed computing.

This model has a vertical orientation suited for surface mounting on PCBs.

It supports a board-to-board connector system.

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