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Samtec Vertical Surface Mount PCB Socket 10-Contact 4 Row 0.635 mm Pitch Solder ADF6

Category PCB Socket Brand Samtec Condition New

Specifications

Country of Origin United States
Voltage 219V
Brand Samtec
Orientation Vertical
Current 1.34A
Model ADF6
Mount Type Surface
Housing Material Liquid Crystal Polymer
Contact Material Copper Alloy
Series ADF6
Termination Type Solder
Maximum Operating Temperature 125°C
Sub Type High Density Socket
Minimum Operating Temperature -55°C
Number of Rows 4
Pitch 0.635mm
Standards/Approvals EU REACH, CHINA RoHS, EU RoHS
Contact Plating Tin over Nickel, Gold
Number of Contacts 10
Connector System Board-to-Board
Stacking Height 5mm
Row Pitch 0.96mm

Key Features

  • Vertical surface mount PCB socket for board-to-board connectivity.
  • 10-contact configuration arranged in 4 rows for high-density interconnects.
  • Very fine 0.635 mm pitch ideal for compact and dense PCB layouts.
  • Edge Rate contact system supports high-speed signal integrity up to 56 Gbps PAM4.
  • Robust liquid crystal polymer housing and gold over nickel contact plating.
  • Supports current ratings up to 1.34 A and voltages up to 219 V.
  • 5 mm stacking height and slim profile for space-constrained designs.

Product Description

The Samtec ADF6-10-03.5-L-4-2-A is a highly compact vertical surface mount PCB Socket engineered for high-density board-to-board connections in advanced electronic assemblies. With 10 contacts organized in 4 rows and a very fine 0.635 mm contact pitch, this socket is ideally suited for applications requiring substantial I/O within a minimized PCB footprint.

This surface mount connector employs advanced Edge Rate contact technology to optimize for signal integrity at high data rates, supporting up to 56 Gbps PAM4 signaling. The 5 mm stacking height and slim width facilitate dense vertical stacking, making it ideal for multi-board systems and complex module integrations where space is at a premium. The housing is constructed from liquid crystal polymer for enhanced durability and heat resistance, while the copper alloy contacts are plated with tin over nickel and gold for reliable electrical performance and corrosion resistance.

With a voltage rating of 219 V and a current capacity of 1.34 A per contact, the socket is robust for a wide range of industrial, telecommunications, computing, and instrumentation use cases. It features a convenient board-to-board connector system with solder termination for simplified, self-aligning assembly processes. The part is rated for continuous operation from -55°C up to 125°C, ensuring reliable performance across demanding environmental conditions found in industrial and laboratory settings.

Typical applications include high-speed computing modules, industrial control systems, advanced instrumentation devices, laboratory test equipment, and anywhere compact, high-reliability board-to-board interconnection is required. Standards compliance ensures suitability for global deployments, as confirmed by EU REACH, China RoHS, and EU RoHS declarations.

Experience premium density and reliability in your electronic assemblies with the Samtec ADF6-10-03.5-L-4-2-A socket. Explore more high-density PCB connectors and sockets from Samtec in the Electronics Components category on EnvMart.

Samtec Vertical Surface Mount PCB Socket 10-Contact 4 Row 0.635 mm Pitch Solder ADF6
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Frequently Asked Questions

The maximum voltage rating for this socket is 219 V.

This socket supports a current capacity of up to 1.34 A per contact.

The contact pitch of this socket is 0.635 mm, making it suitable for high-density applications.

The ADF6 socket has a total of 10 contacts arranged in 4 rows.

The housing is made from liquid crystal polymer, while the contacts are copper alloy plated with tin over nickel and gold.

The stacking height of this socket is 5 mm, allowing for compact installations.

This model operates reliably within a temperature range of -55°C to 125°C.

The socket features a solder termination type for easy assembly.

This socket complies with EU REACH, China RoHS, and EU RoHS standards.

Typical applications include high-speed computing modules, industrial control systems, and advanced instrumentation devices.

It utilizes a board-to-board connector system designed for high-density interconnections.

The orientation of this socket is vertical, suitable for surface mount applications.

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