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| Country of Origin | India |
|---|---|
| Voltage | 318V |
| Brand | Samtec |
| Orientation | Straight |
| Current | 2.2A |
| Model | ERF8 |
| Mount Type | Surface |
| Housing Material | Liquid Crystal Polymer |
| Contact Material | Beryllium Copper Alloy |
| Series | ERF8 |
| Termination Type | Solder |
| Maximum Operating Temperature | 125°C |
| Sub Type | Rugged High-Speed Socket Strip |
| Minimum Operating Temperature | -55°C |
| Number of Rows | 2 |
| Positions | Up to 200 |
| Pitch | 0.8mm |
| Contact Plating | Gold |
| Number of Contacts | 40 |
| Connector System | Board-to-Board |
| Stacking Height | 18mm |
| Row Pitch | 4.5mm |
| Stack Height | 7.00 mm - 16.00 mm |
Samtec ERF8-020-07.0-L-DV-K-TR is a straight surface mount PCB socket engineered for demanding board-to-board applications. This rugged socket offers 40 contacts arranged in 2 rows with a 0.8 mm pitch, making it ideal for compact and high-speed electronic designs.
The Edge Rate contacts feature broad, milled surfaces that improve wear resistance and ensure reliable signal transmission even in challenging environments. With a current capacity of 2.2 amperes and voltage support up to 318 volts, the connector meets the requirements of advanced electronic systems.
The socket is designed for surface mounting, simplifying PCB layout and assembly for modern industrial and commercial electronics. Its stacking height of 18 mm enhances flexibility in multi-board configurations, and the robust housing material, liquid crystal polymer, increases resistance to mechanical and thermal stress.
Gold-plated contacts composed of beryllium copper alloy offer superior conductivity and enhanced durability, reducing signal loss and improving lifetime performance. Operating temperature ranges from -55°C to 125°C, supporting reliable function across diverse applications including manufacturing, communications, instrumentation, and laboratory systems.
Solder termination provides a stable and secure connection, minimizing risk of connectivity issues over time. Board-to-board connector systems benefit from the dual-row, high-density configuration, making this socket suited for industrial automation, PCB prototyping, advanced computing platforms, and high-speed data applications.
Designed for rugged board-to-board connectivity with up to 40 contacts. Reliable performance in harsh industrial environments due to advanced housing and contact materials. High-density pitch suitable for space-constrained PCB layouts and multi-board integration.
Wide operating temperature enables flexible deployment in industrial, commercial, and lab scenarios. Solder mounting simplifies assembly and enhances long-term stability. Explore more Samtec PCB Sockets and connectivity solutions in the Electronics Components category on EnvMart.
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