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TDK 330 nF Multilayer Ceramic Capacitor 25V dc ±10 % Surface Mount Tape & Reel CGA3E3X7R1E334K080AB

Category Multilayer Ceramic Capacitor Brand TDK Condition New

Specifications

Country of Origin India
Voltage 25V dc
Brand TDK
Height 0.8mm
Length 1.6mm
Model CGA3E3X7R1E334K080AB
Packaging Tape & Reel
Width 0.8mm
Mount Type Surface
Construction Stacked
Series CGA
Termination Type Solder
Maximum Operating Temperature 125°C
Tolerance ±10 %
Capacitance 330nF
Minimum Operating Temperature -55°C
Standards/Approvals RoHS, REACH
Package/Case 0603
Dielectric X7R
Automotive Standard AEC-Q200

Key Features

  • Features a 330 nF capacitance with ±10 % tolerance.
  • Rated for 25 V dc operation with X7R dielectric material.
  • Constructed with stacked multilayer ceramic chip technology for mechanical strength.
  • Compact 0603 package size with 1.6 mm length and 0.8 mm width and height.
  • Meets AEC-Q200 automotive standard ensuring durability and reliability.
  • Operates reliably between -55°C and 125°C temperature range.
  • Packaged in tape and reel format for efficient automated assembly.
  • Solder termination type ensures secure PCB mounting.

Product Description

TDK CGA3E3X7R1E334K080AB is a 330 nF multilayer ceramic capacitor designed for high reliability and excellent frequency characteristics in demanding industrial and automotive environments. The surface mount component utilizes a stacked monolithic structure of dielectrics and inner electrodes to provide superior mechanical strength and low equivalent series resistance (ESR) and inductance (ESL) for stable operation.

This capacitor is rated for 25 V dc with a ±10% capacitance tolerance, using an X7R dielectric that supports a wide operating temperature range from -55°C up to 125°C. Its compact 0603 package (1.6 mm length, 0.8 mm width and height) suits compact PCB designs and surface mount manufacturing processes.

The TDK CGA series meets the rigorous AEC-Q200 automotive standard, ensuring the component’s robustness and reliability under automotive system conditions. It is supplied in a tape and reel packaging, allowing efficient pick-and-place assembly in mass production.

Outstanding features include low self-heating and increased resistance to ripple currents due to low ESR. These characteristics make it suitable for electronic circuits in industrial machinery, automotive electronics, telecommunications, and power management systems.

330 nF capacitance with ±10 % tolerance. Voltage rating of 25 V dc with X7R dielectric. Compact 0603 package size for surface mount applications. Compliance with AEC-Q200 automotive standards. Operating temperature from -55°C to 125°C.

Supplied in tape and reel packaging format. Solder termination type ensures reliable PCB mounting. Low ESR and ESL improve frequency response and reduce self-heating.

This Multilayer Ceramic Capacitor is ideal for use in industrial, automotive, electronic assemblies, telecommunications equipment, and other applications requiring compact, high-reliability passive components.

Explore more electronics components and reliable capacitors on EnvMart for your industrial and manufacturing needs.

TDK 330 nF Multilayer Ceramic Capacitor 25V dc ±10 % Surface Mount Tape & Reel CGA3E3X7R1E334K080AB
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Frequently Asked Questions

This model features a capacitance of 330 nF with a tolerance of ±10%.

It is rated for operation at 25 V dc.

The capacitor has a length of 1.6 mm, a width of 0.8 mm, and a height of 0.8 mm, conforming to the 0603 package size.

It operates reliably within a temperature range of -55°C to 125°C.

It uses an X7R dielectric material, which supports a wide temperature range and stability.

It is supplied in tape and reel format, facilitating efficient automated assembly.

This model features a solder termination type, ensuring secure mounting on PCBs.

Yes, it complies with the AEC-Q200 automotive standard, ensuring reliability in automotive applications.

It meets RoHS and REACH standards, ensuring compliance with environmental regulations.

It is constructed using stacked multilayer ceramic chip technology, providing mechanical strength and stability.

It is suitable for use in industrial machinery, automotive electronics, telecommunications, and power management systems.

Low equivalent series resistance (ESR) and inductance (ESL) improve frequency response and reduce self-heating, enhancing performance in electronic circuits.

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