TDK 100 nF 50V dc Multilayer Ceramic Capacitor X7R Dielectric Surface Mount ±10% Tolerance CGA3E2X7R1H104K080AE

TDK CGA3E2X7R1H104K080AE is a multilayer ceramic capacitor designed for surface mount technology, featuring a capacitance of 100 nF and a voltage rating of 50V dc with a tolerance of ±10%. This capacitor employs X7R dielectric, providing stable electrical characteristics across a wide temperature range and is rated for operation between -55°C and 125°C.

The device is housed in a miniature 0603 package, measuring 1.6 mm in length, 0.8 mm in width, and 0.8 mm in height, making it suitable for compact electronic assemblies. It features a soft termination design with conductive resin layers, enhancing mechanical endurance and absorbing thermal and mechanical stresses during assembly and operation.

Certified to automotive standard AEC-Q200, the capacitor is ideal for industrial, automotive, and consumer electronics applications where reliability and performance under thermal cycling and mechanical stress are critical. The tape and reel packaging facilitates efficient automated pick-and-place assembly processes.

Applications include fail-safe battery line designs, prevention of ceramic body cracks due to board flexing, and protection against solder joint crack failures caused by thermal shock. The capacitor is especially useful in high reliability systems such as keyless entry and smart key devices.

Manufactured in Japan, the capacitator delivers high quality and consistent performance required by demanding electronic applications. Features X7R dielectric material optimized for stable temperature and voltage characteristics.

Compact 0603 package with dimensions 1.6 mm length, 0.8 mm width, and 0.8 mm height. Automotive-grade compliance with AEC-Q200 standard ensuring reliability. Soft termination design increases mechanical endurance against thermal and mechanical stress.

Operating temperature range from -55°C to 125°C suitable for various industrial environments. Tape and reel packaging supports automated assembly processes. Ideal for applications requiring prevention of ceramic body cracks and solder joint failures due to board bending and thermal shock.

Manufactured in Japan, ensuring high quality and consistency.

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