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| Country of Origin | India |
|---|---|
| Brand | Texas Instruments |
| Height | 0.55mm |
| Length | 2.05mm |
| Model | TPD6E001RSER |
| Width | 1.55mm |
| Mount Type | Surface |
| Series | TPD6E001 |
| Maximum Operating Temperature | 85°C |
| Package Type | UQFN |
| Minimum Operating Temperature | -40°C |
| Interfaces | USB 3 |
| Pin Count | 10 |
| Number of Elements per Chip | 6 |
| Clamping Voltage VC | 100V |
| Diode Configuration | Complex Array |
| Direction Type | Uni-Directional |
| Minimum Breakdown Voltage Vbr | 11V |
| Test Current It | 10mA |
| Maximum Reverse Leakage Current | 1nA |
Texas Instruments TPD6E001RSER 6-Element Uni-Directional ESD Protection Array in a 10-Pin UQFN package is engineered for advanced electrostatic discharge protection in electronic systems, especially in USB 3 high-speed interfaces. With a complex diode configuration and uni-directional design, it offers reliable transient voltage suppression while maintaining signal integrity due to its low capacitance and leakage.
The device measures 2.05mm in length, 1.55mm in width, and stands 0.55mm tall, optimized for surface mount technology (SMT) allowing for space-saving circuit designs. It operates efficiently within a wide temperature range of -40°C to 85°C, suitable for demanding industrial and commercial applications.
Its electrical characteristics include a minimum breakdown voltage of 11 volts, a clamping voltage of 100 volts, and a test current of 10mA, ensuring robust protection under transient conditions. The low maximum reverse leakage current of 1nA minimizes power dissipation under normal operation.
This ESD Protection Array integrates over-voltage and over-current safeguards, improving the resilience and lifespan of connected components by preventing damage from electrostatic discharges and voltage spikes.
Typical use cases include industrial and consumer electronics, high-speed data interfaces, and any application requiring reliable protection against electrical transients. The ultra-small UQFN package facilitates high-density PCB layouts while maintaining performance.
This device features a complex diode array configuration for reliable performance. The uni-directional design supports integration in surface mount applications. It has a minimum breakdown voltage of 11V and a clamping voltage of 100V ensuring robust protection.
The compact 10-pin UQFN package measures 2.05mm length, 1.55mm width, and 0.55mm height. Operating temperature range is from -40°C to 85°C, suitable for harsh environments. Maximum reverse leakage current is only 1nA, minimizing unwanted current flow.
Designed for USB 3 interface protection at data rates up to 6Gbps. Provides integrated ESD, over voltage, and over current protection for enhanced device reliability. Low capacitance and low leakage current design maintain high signal integrity.
Explore similar semiconductor and ESD protection components in EnvMart's catalog for your electronic design and manufacturing needs.
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