JST SCN Series Male Crimp Terminal 3A Current 28 AWG Min, 22 AWG Max Tin Plated Brass Contact SCN-001T-1.0

JST SCN-001T-1.0 male crimp terminal is a high-quality electrical connector component designed to carry a current of 3A. It supports wire sizes ranging from 28 AWG minimum to 22 AWG maximum, making it versatile for various wire gauges. The contact is made from durable brass material with tin plating to enhance corrosion resistance and ensure stable electrical contact.

This crimp terminal utilizes a crimp termination method, providing secure wire connections that prevent accidental disconnection in industrial and electronic applications. It is specifically designed for use with SCN series connector housings, matching the 2.5 mm pitch pitch standard for compact, high-density PCB mounting.

The solder tail is a Type B design, joining at the tip to prevent breakage and facilitate easy handling during PCB assembly. It is compatible with PCB thicknesses of 1.2 mm or 1.6 mm and cable insulation diameters from 0.9 mm to 1.7 mm. The terminal operates reliably within an industrial temperature range of -25°C to 85°C, suited for diverse environments in electronics manufacturing, power connectors, and wire harness applications.

Manufactured in China, this terminal maintains consistent quality required for professional electronic assembly. Constructed from brass for durability and conductivity. Tin-plated contact surfaces reduce oxidation and increase reliability.

Designed to fit SCN connector housings seamlessly. Solder tails engineered for strength and ease of use in PCB insertion. Supports a wide range of wire sizes from 28 AWG to 22 AWG. Operates effectively in temperatures from -25°C to 85°C.

Compact 2.5 mm pitch ideal for dense PCB layouts. Ensures secure crimp termination for strong mechanical and electrical connection.

This JST SCN series Crimp Terminal is suitable for use in electronics manufacturing, industrial automation, telecommunications, and other applications requiring reliable power and signal connections on printed circuit boards. It enhances production efficiency by allowing easy insertion into machinery and supports mass-volume packaging in multiples of 100 units.

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