DiodesZetex Buffer & Line Driver Open Drain Non-Inverting 5-Pin TSSOP 1 Channel LVC Logic 74LVC1G07SE-7

DiodesZetex 74LVC1G07SE-7 is a buffer and line driver IC designed for surface-mount applications, featuring open drain non-inverting output and a single channel configuration. Operating within the low-voltage CMOS logic family, the device supports a broad supply voltage range from 1.65 V up to 5.5 V, making it versatile for various electronic circuits.

The 5-pin TSSOP package offers a compact footprint with precise dimensions of 2.2 mm length and width and 1 mm height, suitable for high-density PCB layouts. Designed to operate in harsh environments, it supports an extended temperature range from -40°C to +150°C to ensure reliability in industrial and commercial deployments.

The buffer’s maximum propagation delay time of 2.5 ns ensures fast signal transmission with minimal latency, vital for timing-critical applications. It has a maximum low-level output current rating of 32 mA, adequately driving loads requiring moderate current.

This IC's compatibility with LVTTL/TTL input signals and LVCMOS output levels provides seamless interfacing with various logic families. Its low supply current of just 10 μA contributes to reduced power consumption, enhancing battery life in portable devices.

Low-voltage CMOS logic family with wide operating voltage range. Open drain, non-inverting buffer function with single-ended input. Compact 5-pin TSSOP surface-mount package. High-speed performance with low propagation delay.

Wide operating temperature from -40°C to 150°C. Compatible with LVTTL/TTL input and LVCMOS output logic levels. Low supply current design for efficient power usage. Robust industrial-grade operation for interface IC applications.

Suitable for signal buffering, line driving, and electronic interfaces.

This buffer and line driver IC is suitable for electronic components, power and connector applications, semiconductor line interface IC uses, and various industrial and electronic control systems. It is ideal for enhancing signal integrity and driving loads in compact electronic designs.

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