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Hirose DF23 Series Straight Surface PCB Socket 20-Contact 2 Row 0.5 mm Pitch Solder

Category PCB Socket Brand Hirose Condition New

Specifications

Country of Origin Japan
Voltage 50V
Brand Hirose
Orientation Straight
Current 300mA
Model DF23
Mount Type Surface
Housing Material Liquid Crystal Polymer
Contact Material Copper
Series DF23
Termination Type Solder
Maximum Operating Temperature 85°C
Minimum Operating Temperature -35°C
Number of Rows 2
Pitch 0.5mm
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RS Stock No. 724-1015Brand: HiroseManufacturers Part No.: DF23C-20DS-0.5V(51)
Contact Plating Gold
Number of Contacts 20
Contact Gender Female
Connector System Board-to-Board, Board-to-FPC
Stacking Height 1.5mm
Row Pitch 4.4mm

Key Features

  • Features a low profile 1.5 mm board-to-board distance for compact designs.
  • Utilizes high-reliability copper contacts with gold plating for corrosion resistance.
  • Constructed from liquid crystal polymer housing for durability and thermal stability.
  • Supports board-to-board and board-to-FPC connector systems enabling versatile applications.
  • Operates safely up to 50 V and 300 mA with a temperature range from -35°C to 85°C.
  • Designed for straight orientation and surface mount installation to facilitate assembly.
  • Ensures high contact reliability with a positive click sensation during mating.
  • Produced in Japan maintaining high manufacturing standards.

Product Description

Hirose DF23C-20DS-0.5V(51) PCB Socket is part of the DF23 series, designed for reliable low-profile board-to-board and board-to-FPC connections. It features a 0.5 mm pitch and a 20-contact, 2-row configuration optimized for compact electronic assemblies requiring precise surface mounting with solder termination.

The socket housing is made from liquid crystal polymer, offering excellent mechanical robustness and thermal resistance suitable for industrial and commercial electronics. The contact pins are copper with gold plating, enhancing conductivity and corrosion resistance for long-term durability.

This surface mount, straight orientation socket supports a board-to-board spacing of 1.5 mm, enabling compact layouts without compromising electrical performance. The connector system is compatible for board-to-board and board-to-FPC applications, broadening its usability across various PCB designs. The component is rated for up to 50 volts and 300 milliamps, with an operating temperature range from minus 35 to plus 85 degrees Celsius, making it suitable for diverse operating environments including industrial, laboratory, and electronic manufacturing contexts.

The DF23C-20DS-0.5V(51) socket delivers a distinct click sensation upon mating which ensures confident connection and alignment, supported by its large self-alignment feature which assists automated board placement equipment. Manufactured in Japan, this Hirose product adheres to strict quality standards ensuring performance and reliability.

Features a low profile 1.5 mm board-to-board distance for compact designs. Utilizes high-reliability copper contacts with gold plating for corrosion resistance. Constructed from liquid crystal polymer housing for durability and thermal stability.

Supports board-to-board and board-to-FPC connector systems enabling versatile applications. Operates safely up to 50 V and 300 mA with a temperature range from -35°C to 85°C. Designed for straight orientation and surface mount installation to facilitate assembly.

Ensures high contact reliability with a positive click sensation during mating. Produced in Japan maintaining high manufacturing standards.

This PCB Socket is ideal for electronic component manufacturing, industrial instrumentation, medical devices, telecommunications, and other applications requiring secure and reliable PCB connections. Explore more Hirose connectors and related solutions within the EnvMart catalog for advanced electronic assembly and maintenance.

Hirose DF23 Series Straight Surface PCB Socket 20-Contact 2 Row 0.5 mm Pitch Solder
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Frequently Asked Questions

This model operates safely up to 50 volts.

It is rated for a maximum current of 300 milliamps.

The operating temperature range is from -35°C to 85°C.

The housing is made from liquid crystal polymer, and the contact pins are copper with gold plating for enhanced conductivity and corrosion resistance.

This socket features 20 contacts arranged in a 2-row configuration.

The pitch size is 0.5 mm.

It utilizes solder termination for secure connections.

The stacking height is 1.5 mm, allowing for compact designs.

It supports both board-to-board and board-to-FPC connector systems.

This socket is designed for straight orientation and surface mount installation.

It is produced in Japan, adhering to high manufacturing standards.

It provides a positive click sensation during mating, ensuring high contact reliability.

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