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CIF Single-Sided FR4 Epoxy Glass Fabric Laminate Matrix Board 1.6mm Thickness 1mm Holes 2.54mm Pitch 510mm x 160mm AGP58
Specifications
| Country of Origin | France |
|---|---|
| Brand | CIF |
| Length | 510mm |
| Model | AGP58 |
| Width | 160mm |
| Hole Diameter | 1mm |
| Board Material | Epoxy Glass Fabric Laminate |
| Standards/Approvals | RoHS |
| Number of Sides | 1 |
| Board Thickness | 1.6mm |
| FR Material Grade | FR4 |
| Hole Pitch | 2.54mm |
| Copper Thickness | 35μm |
| CIF 1 Matrix Board FR4 1 mm Holes, 2.54 mm Pitch, 300 mm 160mmBrand | CIF |
Key Features
- The board features a 1.6 mm thickness ensuring durability and stability.
- It has 1 mm diameter holes positioned at 2.54 mm pitch.
- The dimensions are 510 mm length by 160 mm width for ample prototyping area.
- Square copper-tin plated pads measure 2 mm by 2 mm with a 0.54 mm gap between tracks.
- This matrix board complies with RoHS standards for environmental safety.
- Manufactured in France offering superior quality and reliability.
Product Description
CIF AGP58 is a single-sided matrix board made with high-quality FR4 epoxy glass fabric laminate, featuring a board thickness of 1.6 mm. This prototyping board is designed for electronics development and testing, providing reliable copper-tin plated square pad cards with precise 1 mm holes arranged in a 2.54 mm pitch pattern.
The board measures 510 mm in length and 160 mm in width, making it suitable for various circuit prototyping projects. Copper thickness of 35 μm ensures optimum electrical conductivity and durability. The gap between copper tracks is 0.54 mm, and each square pad is 2 mm by 2 mm in size, facilitating effective soldering and component placement.
This Matrix Board complies with RoHS standards confirming it is free from hazardous substances, making it a responsible choice for environmentally conscious engineering. Manufactured in France, it guarantees consistent quality and precision required for industrial and laboratory electronics prototyping applications.
Ideal for use in electronics laboratories, manufacturing R&D, educational projects, and hobbyist prototyping, this board supports development and testing of custom circuits with ease. Its single-sided copper layer simplifies layout designs and soldering procedures for efficient project execution.
The board thickness of 1.6 mm provides mechanical stability and robust handling. Precise drilled 1 mm holes ensure compatibility with standard electronic components. 2.54 mm pitch conforms to industry-standard spacing for components and connectors.
Copper thickness of 35 μm offers reliable electrical performance and durability.
Choose CIF AGP58 to enhance your prototyping accuracy and reliability. Available under the CIF brand known for quality electronic components on EnvMart, your trusted industrial marketplace.
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Frequently Asked Questions
The thickness of this matrix board is 1.6 mm, providing mechanical stability and robust handling for prototyping projects.
The board measures 510 mm in length and 160 mm in width, offering ample space for various circuit prototyping applications.
It features 1 mm diameter holes arranged at a 2.54 mm pitch, ensuring compatibility with standard electronic components.
The board is constructed from FR4 epoxy glass fabric laminate, known for its reliability in electronics applications.
The copper thickness on the CIF AGP58 matrix board is 35 μm, which ensures optimum electrical conductivity and durability.
Yes, it complies with RoHS standards, confirming that it is free from hazardous substances, making it an environmentally responsible choice.
This matrix board is single-sided, which simplifies layout designs and soldering procedures.
Each square pad measures 2 mm by 2 mm, with a 0.54 mm gap between the copper tracks, facilitating effective soldering and component placement.
It is manufactured in France, ensuring consistent quality and precision for industrial and laboratory electronics prototyping applications.
It is ideal for electronics laboratories, manufacturing R&D, educational projects, and hobbyist prototyping, supporting the development and testing of custom circuits.
The gap between the copper tracks is 0.54 mm, which aids in component placement and soldering.
The matrix board is from the brand CIF, known for quality electronic components.
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