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Samtec SEAF Series Straight Surface PCB Socket 160-Contact 4 Row 1.27mm Pitch 240V SEAF-40-06.0-S-04-2-A-K-TR
Specifications
| Country of Origin | India |
|---|---|
| Voltage | 240V |
| Brand | Samtec |
| Orientation | Straight |
| Current | 2.7A |
| Model | SEAF-40-06.0-S-04-2-A-K-TR |
| Mount Type | Surface |
| Housing Material | Liquid Crystal Polymer |
| Contact Material | Copper Alloy |
| Series | SEAF |
| Termination Type | Solder |
| Maximum Operating Temperature | 125°C |
| Sub Type | High Speed High Density Open-Pin-Field Array Socket |
| Minimum Operating Temperature | -55°C |
| Number of Rows | 4 |
| Pitch | 1.27mm |
| Contact Plating | Gold |
| Number of Contacts | 160 |
| Contact Gender | Female |
| Connector System | Board-to-Board |
| Stacking Height | 18.5mm |
| Row Pitch | 2.5mm |
Key Features
- This PCB socket features 160 contacts arranged in 4 rows for high density connectivity.
- It uses a 1.27 mm pitch and supports a current rating of 2.7A per contact.
- The housing material is liquid crystal polymer providing durability and stability.
- It is a surface mount type with straight orientation and solder termination.
- The socket operates reliably between -55°C and 125°C temperatures.
- Contact plating of gold ensures excellent conductivity and corrosion resistance.
- The stacking height of this socket is 18.5 mm, suitable for compact assemblies.
- Designed for a voltage rating of 240V, ideal for demanding electronics applications.
Product Description
Samtec SEAF-40-06.0-S-04-2-A-K-TR is a high-speed, high-density PCB socket designed for surface mount applications requiring board-to-board connections. The socket features 160 female contacts arranged in 4 rows with a 1.27 mm pitch, supporting a current capacity of 2.7A and a voltage rating of 240V.
Manufactured with a liquid crystal polymer housing and copper alloy contact material, the contacts have selective gold plating for enhanced durability and conductivity. The straight orientation and solder termination type enable reliable, stable mounting on PCB surfaces. Operating temperature ranges from -55°C to 125°C ensure suitability for harsh industrial and electronic environments.
The 18.5 mm stacking height accommodates various assembly designs while tape and reel packaging support automated manufacturing processes. Alignment pins and polyimide film pick and place pads improve placement accuracy during PCB assembly.
This SEAF series socket is ideal for applications including industrial electronics, telecommunications, computing hardware, and embedded system assembly requiring reliable, high-density connector solutions.
This PCB socket features 160 contacts arranged in 4 rows for high density connectivity. It uses a 1.27 mm pitch and supports a current rating of 2.7A per contact. The housing material is liquid crystal polymer providing durability and stability.
It is a surface mount type with straight orientation and solder termination. The socket operates reliably between -55°C and 125°C temperatures. Contact plating of gold ensures excellent conductivity and corrosion resistance.
The stacking height of this socket is 18.5 mm, suitable for compact assemblies. Designed for a voltage rating of 240V, ideal for demanding electronics applications. It is taped and reeled for automated pick and place assembly processes.
Alignment pins and polyimide film pick and place pads facilitate precise placement during manufacturing. Explore the Samtec SEAF series in our Electronics & Electricals > Electronics Components > PCB Sockets category for advanced PCB connection options.
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Frequently Asked Questions
This socket supports a current rating of 2.7A per contact.
The voltage rating for this model is 240V, making it suitable for demanding electronics applications.
It operates reliably between -55°C and 125°C, ensuring suitability for harsh environments.
This socket features 160 female contacts arranged in 4 rows.
The contacts are arranged with a pitch of 1.27 mm, allowing for high-density connectivity.
The housing is made of liquid crystal polymer, while the contacts are made from copper alloy with gold plating for enhanced conductivity.
It is a surface mount type with a straight orientation and solder termination.
The stacking height of this socket is 18.5 mm, suitable for compact assemblies.
This socket is designed for a board-to-board connector system.
The alignment pins and polyimide film pick and place pads facilitate precise placement during PCB assembly, improving manufacturing accuracy.
This socket is manufactured in India.
It is ideal for applications in industrial electronics, telecommunications, computing hardware, and embedded system assembly.
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