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Samtec Series Vertical Surface PCB Socket, 100-Contact, 2 Row, 0.8 mm Pitch, 2.2A Current, 318V Voltage, Liquid Crystal ERF8
Specifications
| Country of Origin | India |
|---|---|
| Voltage | 318V |
| Brand | Samtec |
| Orientation | Vertical |
| Current | 2.2A |
| Model | ERF8 |
| Mount Type | Surface |
| Housing Material | Liquid Crystal Polymer |
| Contact Material | Beryllium Copper Alloy |
| Series | ERF8 |
| Termination Type | Solder |
| Maximum Operating Temperature | 125°C |
| Sub Type | Board-to-Board |
| Minimum Operating Temperature | -55°C |
| Number of Rows | 2 |
| Pitch | 0.8mm |
| Contact Plating | Gold |
| Number of Contacts | 100 |
| Connector System | Board-to-Board |
| Stacking Height | 18mm |
| Row Pitch | 4.5mm |
Key Features
- Designed for vertical mounting on PCBs for reliable board-to-board connections.
- Constructed with Liquid Crystal Polymer housing for durability and heat resistance.
- Features gold-plated beryllium copper alloy contacts ensuring superior conductivity.
- High stacking height of 18 mm suitable for complex PCB stacks.
- Operating temperature range from -55°C to 125°C supports diverse environments.
- Row pitch of 4.5 mm accommodates precise placement requirements.
- Supports high-speed data transfer applications up to 56Gbps PAM4 performance.
- Termination by solder ensures secure and robust assembly on PCB surfaces.
Product Description
Samtec ERF8 Series Vertical Surface PCB Socket ERF8 is a high-performance, 100-position, 2-row vertical PCB socket designed for reliable board-to-board interfacing in demanding electronic systems.
This socket features a 0.8 mm pitch and supports a continuous current rating of 2.2A with a voltage capability up to 318V, making it suitable for high-speed data and power transfer applications.
Constructed from Liquid Crystal Polymer housing, the ERF8 series offers robust mechanical strength and high temperature resistance, allowing operation from -55°C to 125°C, ensuring durability in harsh environments.
Gold-plated beryllium copper alloy contacts provide excellent electrical conductivity and corrosion resistance, while the solder termination type assures secure mounting and optimal signal integrity on PCB surfaces.
The 18 mm stacking height and 4.5 mm row pitch offer flexibility in system design and mechanical assembly, supporting complex multi-board arrangements. Applications include industrial electronics, telecommunications, computing, and other sectors requiring reliable high-speed interconnections and robust electrical performance.
Designed for vertical mounting on printed circuit boards. Constructed with durable Liquid Crystal Polymer housing material. Gold-plated beryllium copper contacts for enhanced conductivity and longevity. Accommodates up to 100 contacts in a 2-row arrangement.
Operates effectively across a broad temperature range from -55°C to 125°C. Offers a stacking height of 18 mm for system integration flexibility. Supports board-to-board connection with 0.8 mm pitch and solder termination.
Suitable for high-speed signal transmission up to 56 Gbps PAM4. Rated for operating voltage of 318V and current of 2.2A. Ideal for use in electronic manufacturing, communications, and industrial automation. Explore further in the PCB Sockets category for specialized connectors and sockets suited for electronic system assembly and design.
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Frequently Asked Questions
The maximum current rating of this model is 2.2A.
This socket has a voltage capability of up to 318V.
The contact pitch of this model is 0.8 mm.
It is constructed with Liquid Crystal Polymer housing and features gold-plated beryllium copper alloy contacts.
The operating temperature range is from -55°C to 125°C.
This vertical socket accommodates up to 100 contacts in a 2-row arrangement.
The stacking height of this socket is 18 mm, allowing for flexible system integration.
This model uses solder termination for secure mounting on PCB surfaces.
The row pitch is 4.5 mm, accommodating precise placement requirements.
It is suitable for applications in industrial electronics, telecommunications, and computing, requiring reliable high-speed interconnections.
This socket provides a board-to-board connector system for reliable interfacing.
The country of origin for this socket is India.
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