Samtec ERF8 Series Vertical Surface PCB Socket 50-Contact 2 Row 0.8 mm Pitch Solder ERF8

The Samtec ERF8 Series Vertical Surface PCB Socket ERF8 is a high-performance board-mounted socket featuring 50 contacts in two rows with a 0.8 mm pitch, ideal for compact, high-speed electronic applications requiring reliable electrical connections.

Constructed with a durable Liquid Crystal Polymer housing and Beryllium Copper Alloy contacts plated with gold, this socket ensures longevity and excellent conductivity. Its vertical orientation and surface mount design facilitate dense PCB assembly with a stacking height of 18 mm for efficient space management.

Operating effectively between -55°C and 125°C, the socket supports a voltage of 318 V and a current rating of 2.2 A, suitable for demanding industrial and electronic environments. The solder termination type guarantees secure and robust attachment to PCB pads.

Used primarily in electronics manufacturing, laboratory instrumentation, telecommunications, and industrial automation, this socket is designed for board-to-board connector systems to enable versatile and reliable interconnect solutions.

This socket supports 50 contacts arranged in 2 rows. It has a pitch of 0.8 mm suitable for dense PCB layouts. The housing material is rugged Liquid Crystal Polymer for durability. The contact material is Beryllium Copper Alloy with gold plating for excellent conductivity.

It features vertical orientation and surface mount for compact assembly. Stacking height is 18 mm to enable proper mechanical clearance. It operates reliably over a wide temperature range from -55°C to 125°C. Rated for a voltage of 318 V and current of 2.2 A.

Termination type is solder ensuring secure electrical connections. Designed for board-to-board connector systems providing robust interconnections.

Whether used in industrial electronics, telecommunications, or laboratory instrumentation, the ERF8 socket delivers robust performance in demanding environments. This component is essential for high-speed data transfer systems and tightly packed PCB designs.

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