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Samtec ERF8 Series Vertical Surface PCB Socket, 40-Contact, 2 Row, 0.8 mm Pitch, Solder Termination

Category PCB Socket Brand Samtec Condition New

Specifications

Country of Origin India
Voltage 318V
Brand Samtec
Orientation Vertical
Current 2.2A
Model ERF8
Mount Type Surface
Housing Material Liquid Crystal Polymer
Contact Material Beryllium Copper Alloy
Series ERF8
Termination Type Solder
Maximum Operating Temperature 125°C
Sub Type Board-to-Board
Minimum Operating Temperature -55°C
Number of Rows 2
Pitch 0.8mm
Contact Plating Gold
Number of Contacts 40
Connector System Board-to-Board
Stacking Height 18mm
Row Pitch 4.5mm

Key Features

  • Provides reliable vertical orientation for PCB stacking.
  • Constructed with liquid crystal polymer housing for durability.
  • Features beryllium copper alloy contacts plated with gold for superior conductivity.
  • Supports current rating of 2.2A and voltage of 318V.
  • Operates effectively within -55°C to 125°C temperature range.
  • Designed for high-speed systems supporting up to 56Gbps PAM4 performance.
  • Stacking height is 18 mm with 4.5 mm row pitch for compact integration.
  • Termination type is solder for secure PCB attachment.

Product Description

Samtec ERF8 ERF8-020-07.0-L-DV-TR is a vertical surface-mounted PCB socket designed for advanced electronic applications requiring robust and high-speed board-to-board connections. It features a 40-contact, 2-row configuration with a fine 0.8 mm pitch, suitable for compact PCB designs.

The socket's housing is made from liquid crystal polymer, offering mechanical strength and thermal stability required in industrial and commercial electronics. Its contacts are fabricated from beryllium copper alloy and plated with gold, ensuring excellent electrical conductivity and resistance to corrosion.

This socket supports a current rating of 2.2A and a voltage rating of 318V, making it suitable for a range of power and signal applications. It is engineered to operate reliably in harsh temperature environments from -55°C up to 125°C, accommodating demanding industrial and telecommunications applications.

The ERF8 series supports vertical orientation with a stacking height of 18 mm and a row pitch of 4.5 mm, enabling efficient board stacking and spacing. The solder termination provides secure mounting to the PCB, ensuring durability through thermal cycles and mechanical stresses.

This component is ideal for use in electronics manufacturing, telecommunications equipment, industrial controls, and other high-speed system applications requiring reliable PCB interconnections with a data rate capability of up to 56Gbps PAM4 signaling.

Reliable vertical orientation for stack height optimization. Durable liquid crystal polymer housing material. Beryllium copper alloy contacts with gold plating. Current rating of 2.2A and voltage rating of 318V. Wide operating temperature range from -55°C to 125°C.

Compact 0.8 mm pitch for high-density PCB layouts. Secure solder termination for robust PCB mounting. Supports high-speed data rates up to 56Gbps PAM4.

Samtec's ERF8 PCB socket series reinforces reliable board-to-board connections in demanding industrial, telecommunications, and commercial electronic applications. Browse more PCB Sockets and connectors at EnvMart to find components that match your project specifications and quality standards.

Samtec ERF8 Series Vertical Surface PCB Socket, 40-Contact, 2 Row, 0.8 mm Pitch, Solder Termination
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Frequently Asked Questions

This model supports a current rating of 2.2A and a voltage rating of 318V.

It operates effectively within a temperature range of -55°C to 125°C.

The stacking height is 18 mm with a row pitch of 4.5 mm.

The housing is made from liquid crystal polymer, and the contacts are fabricated from beryllium copper alloy plated with gold.

This model features 40 contacts arranged in a 2-row configuration.

It uses solder termination for secure attachment to the PCB.

The pitch of this socket is 0.8 mm, suitable for compact PCB designs.

This socket is designed for vertical orientation, optimizing board stacking.

It is ideal for electronics manufacturing, telecommunications equipment, and industrial controls requiring high-speed interconnections.

It supports high-speed data rates of up to 56Gbps PAM4 signaling.

The country of origin for this PCB socket is India.

It utilizes a board-to-board connector system, facilitating robust interconnections.

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