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Samtec ERF8 Series Right Angle Surface PCB Socket 20-Contact 2 Row 0.8 mm Pitch Solder
Specifications
| Country of Origin | India |
|---|---|
| Voltage | 318V |
| Brand | Samtec |
| Orientation | Right Angle |
| Current | 2.2A |
| Model | ERF8 |
| Mount Type | Surface |
| Housing Material | Liquid Crystal Polymer |
| Contact Material | Beryllium Copper Alloy |
| Series | ERF8 |
| Termination Type | Solder |
| Maximum Operating Temperature | 125°C |
| Sub Type | Board-to-Board |
| Minimum Operating Temperature | -55°C |
| Number of Rows | 2 |
| Pitch | 0.8mm |
| Contact Plating | Gold |
| Number of Contacts | 20 |
| Connector System | Board-to-Board |
| Stacking Height | 18mm |
| Row Pitch | 4.5mm |
Key Features
- Designed for high-speed systems supporting up to 56 Gbps PAM4 signaling.
- Right angle orientation suitable for surface mount applications.
- Housing made of durable liquid crystal polymer for stability.
- Contacts made from beryllium copper alloy with gold plating for corrosion resistance.
- Operates reliably between -55°C to 125°C temperature range.
- Rated for 2.2A current and 318V voltage tolerance.
- Provides an 18 mm stacking height and 4.5 mm row pitch.
- Terminated via solder for secure PCB mounting.
Product Description
Samtec ERF8 ERF8-010-01-L-D-RA-TR is a high-performance right angle surface PCB socket engineered for board-to-board electrical connectivity in demanding high-speed applications. Featuring 20 contacts arranged in 2 rows with a precise 0.8 mm pitch, this socket supports signal performance up to 56 Gbps PAM4, making it ideal for advanced communications and computing systems. The robust liquid crystal polymer housing ensures mechanical stability and durability.
This PCB socket includes contact pins fabricated from beryllium copper alloy, coated with gold plating to enhance electrical conductivity and resist corrosion over long-term use. Designed to operate effectively within a wide temperature range of -55°C to 125°C, it supports current ratings up to 2.2 A and voltage threshold up to 318 V. The right angle orientation facilitates compact PCB layouts while maintaining reliable mechanical and electrical connection.
With an 18 mm stacking height and 4.5 mm row pitch, the component is optimized for surface mounting via solder termination, ensuring secure integration onto printed circuit boards. It is suitable for use in various industrial sectors including electronics manufacturing, telecommunications equipment, high-speed computing, and systems integration.
Built for high-speed data transmission with up to 56 Gbps PAM4 capability. Right angle surface mount design allows efficient PCB layout. Liquid crystal polymer construction delivers high durability and heat resistance. Beryllium copper alloy contacts with gold plating improve conductivity and corrosion resistance.
Wide operating temperature range from -55°C to 125°C supports industrial environments. Supports 2.2 A current and 318 V voltage for versatile electrical applications. 18 mm stacking height and 4.5 mm row pitch suit compact assembly requirements.
Solder termination assures a reliable electrical and mechanical connection. Applicable to industrial, electronic, telecommunications, and computing systems. Part of the ERF8 series for consistent performance and compatibility.
Explore our Electronics Components catalog for additional PCB Sockets and connectors to enhance your designs and manufacturing projects. Samtec ERF8 series delivers quality and reliability for professional and industrial applications through EnvMart.
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Frequently Asked Questions
This model supports data transmission rates up to 56 Gbps PAM4, making it suitable for high-speed applications.
It operates reliably within a temperature range of -55°C to 125°C.
The socket is rated for a maximum current of 2.2 A and a voltage tolerance of 318 V.
The housing is made of liquid crystal polymer, while the contact pins are fabricated from beryllium copper alloy and coated with gold plating for enhanced conductivity and corrosion resistance.
It features an 18 mm stacking height and a row pitch of 4.5 mm, which are optimized for compact PCB layouts.
This model has a total of 20 contacts arranged in 2 rows.
It uses solder termination for secure mounting on printed circuit boards.
The socket features a right angle orientation, suitable for surface mount applications.
It is applicable in various sectors including electronics manufacturing, telecommunications equipment, high-speed computing, and systems integration.
The contact pitch is 0.8 mm, facilitating precise connections in high-density applications.
The country of origin for this product is India.
It utilizes a board-to-board connector system, designed for reliable electrical connectivity between PCBs.
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