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| Country of Origin | India |
|---|---|
| Voltage | 194V |
| Brand | Samtec |
| Orientation | Vertical |
| Current | 1.6A |
| Model | ERF5 |
| Mount Type | Surface |
| Housing Material | Liquid Crystal Polymer |
| Contact Material | Beryllium Copper Alloy |
| Series | ERF5 |
| Termination Type | Solder |
| Maximum Operating Temperature | 125°C |
| Sub Type | Board-to-Board |
| Minimum Operating Temperature | -55°C |
| Number of Rows | 2 |
| Pitch | 0.5mm |
| Contact Plating | Gold |
| Number of Contacts | 20 |
| Connector System | Board-to-Board |
| Stacking Height | 12mm |
Samtec ERF5 is a vertical surface-mounted board-to-board PCB socket, model ERF5, engineered to provide reliable high-speed interconnections. It features 20 contacts arranged in 2 rows with a compact 0.5 mm pitch, making it suitable for dense PCB designs in industrial and commercial electronics.
This socket utilizes a housing made from liquid crystal polymer, offering excellent mechanical stability and performance under thermal stress. The contact material is a beryllium copper alloy plated with gold, ensuring low contact resistance and good corrosion resistance for long-term reliable connections.
The ERF5 socket supports a maximum operating current of 1.6A and voltage rating of 194V, suitable for many power and signal applications. It offers a stacking height of 12 mm which facilitates multi-board stacking configurations with vertical orientation for optimized PCB layouts.
Operable within a temperature range of -55 °C to +125 °C, this component is suitable for demanding industrial, telecommunications, computing, and high-speed data transmission systems. Its Edge Rate contact system is specifically designed to endure high mating cycles and support data rates up to 28 Gbps, ensuring robust performance in advanced electronic applications.
No official RoHS certification or additional industry approvals are documented for this model. It is offered in reel packaging to facilitate efficient assembly line usage in manufacturing environments.
Constructed with liquid crystal polymer housing for durability. Designed to handle current up to 1.6A for reliable electrical performance. Gold-plated beryllium copper alloy contacts ensure excellent conductivity. Supports a stacking height of 12 mm for compact system integration.
Operates safely across a wide temperature range from -55°C to 125°C. Supports a voltage rating of up to 194V. Features a vertical orientation for surface mounting on PCBs. Utilizes Edge Rate contact system for high mating cycles and 28 Gbps performance.
Ideal for high-speed and high-reliability electronic systems. No additional certifications or approvals are specified.
Suitable for industrial, telecommunications, computing, and high-speed data transmission applications requiring reliable, compact, and high-performance PCB interconnections. Browse more products in PCB Sockets at EnvMart for complementary electronic components.
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