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onsemi 4-Element Photomultiplier Surface BGA Package ArrayJ-60035-4P-BGA

Category PCB Connectors Brand onsemi Condition New

Specifications

Country of Origin India
Brand onsemi
Height 2.2mm
Length 12.46mm
Model ArrayJ-60035-4P-BGA
Width 12.46mm
Mount Type Surface
Series J SiPM
Package Type BGA
Element Type Photomultiplier
Standards/Approvals J-STD-20
Number of Pins 9
Number of Elements 4
Wavelength of Peak Sensitivity 420nm

Key Features

  • Features a 4-element silicon photomultiplier array optimized for 420nm peak sensitivity.
  • Utilizes a Ball Grid Array (BGA) package with surface mount design for efficient PCB integration.
  • Compact dimensions with 12.46mm length and width, and 2.2mm height.
  • Includes 9-pin connection supporting multi-way or fast output signals.
  • Constructed with TSV-packaged J-Series sensors ensuring minimal dead space and high fill factor exceeding 90%.
  • ArrayJ allows individual pixel readout for imaging or summed signals for large-area sensing.
  • Standard compliance with J-STD-20 approval ensuring quality and reliability.
  • Suitable for applications in medical imaging, biophotonics, hazard detection, 3D sensing, and high energy physics.

Product Description

onsemi ArrayJ-60035-4P-BGA is a 4-Element Photomultiplier featuring a surface mount Ball Grid Array (BGA) package. This advanced silicon photomultiplier (SiPM) array from onsemi’s J-Series is engineered for high fill-factor, scalable photodetection with exceptional peak sensitivity at 420nm wavelength.

The device measures 12.46mm in length and width, with a height of 2.2mm, making it compact for seamless integration on printed circuit boards. It uses 9 pins arranged in a BGA format to connect multi-way or fast output signals from each pixel, supporting flexibility in signal readout techniques. These TSV-packaged microcells allow for minimal dead space and a fill factor greater than 90%, enhancing detection efficiency and area coverage.

Each ArrayJ device consists of either 3mm, 4mm, or 6mm pixel sizes arranged in formats from 2x2 up to 8x8 arrays. The ArrayJ-60035-4P-BGA specifically accommodates four pixels, providing highly sensitive, reliable sensing capabilities. The output signals from the pixels can be accessed individually which is ideal for imaging applications or summed to create a single-channel large area sensor.

The product complies with the J-STD-20 quality standard, assuring stable and consistent performance suitable for demanding environments.

Typical applications of the ArrayJ-60035-4P-BGA include medical imaging modalities, biophotonics research, high-energy physics experiments, hazard and threat detection, and advanced 3D ranging and sensing. This makes the device highly valuable for industrial, laboratory, and scientific instrumentation requiring precise photon detection capabilities.

Features a 4-element silicon photomultiplier optimized for 420nm wavelength sensitivity. Compact surface mount BGA package with 9 pins for signal output. High fill-factor, scalable arrays with minimal dead space exceeding 90% coverage.

Individual pixel signals accessible for imaging or collective summation. Compliant with J-STD-20 ensuring quality and reliability. Applications include medical imaging, 3D sensing, biophotonics, and high-energy physics. Small footprint with dimensions 12.46mm x 12.46mm x 2.2mm for PCB integration.

Explore onsemi photomultiplier solutions on EnvMart for advanced electronic components used in cutting-edge scientific and industrial applications.

Explore more products in our PCB Connectors category.

onsemi 4-Element Photomultiplier Surface BGA Package ArrayJ-60035-4P-BGA
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Frequently Asked Questions

The ArrayJ-60035-4P-BGA photomultiplier is optimized for a peak sensitivity at 420nm wavelength.

This unit has dimensions of 12.46mm in length and width, and a height of 2.2mm, making it compact for PCB integration.

The ArrayJ-60035-4P-BGA contains four elements in its silicon photomultiplier array.

It utilizes a Ball Grid Array (BGA) package, suitable for surface mount design.

The ArrayJ-60035-4P-BGA features a 9-pin connection for multi-way or fast output signals.

The fill factor of this model exceeds 90%, ensuring minimal dead space and high detection efficiency.

It complies with the J-STD-20 quality standard, ensuring reliability and performance.

This model is suitable for applications in medical imaging, biophotonics, hazard detection, 3D sensing, and high energy physics.

The ArrayJ-60035-4P-BGA belongs to the J SiPM series of silicon photomultipliers.

The microcells are TSV-packaged, allowing for minimal dead space and enhancing area coverage.

Yes, the output signals from each pixel can be accessed individually, which is ideal for imaging applications.

The country of origin for this model is India.

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