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CIF Single Sided Matrix Board Synthetic Resin Bonded Paper FR2 1 mm Holes 2.54 mm Pitch 220 x 100 x 1.6 mm ACP22

Category Matrix Board Brand CIF Condition New

Specifications

Country of Origin France
Brand CIF
Length 220mm
Model ACP22
Width 100mm
Hole Diameter 1mm
Board Material Synthetic Resin Bonded Paper
Standards/Approvals ANSI/ESD S20, BS EN 61340
Number of Sides 1
Board Thickness 1.6mm
FR Material Grade FR2
Hole Pitch 2.54mm
Copper Thickness 35μm

Key Features

  • The board is constructed from synthetic resin bonded paper, providing durability and stability.
  • It has a single-sided design with 1 mm diameter holes at a 2.54 mm pitch for component placement.
  • The copper thickness is 35 μm with 15/10th tinned copper clad pads sized 2 mm each side.
  • Board dimensions are 220 mm in length, 100 mm in width, and 1.6 mm in thickness.
  • The board complies with ANSI/ESD S20 and BS EN 61340 standards for ESD control.
  • FR Material grade is FR2, offering flame retardant properties.
  • Suitable for use as a pre-design tool and laying out electrical components securely.
  • Used to customize circuit board fabrications for varied electronics applications.

Product Description

The CIF ACP22 single sided matrix board is a high-quality prototyping board made from synthetic resin bonded paper with an FR2 flame retardant material grade. It measures 220 mm in length, 100 mm in width, and 1.6 mm in thickness. The board features precisely drilled 1 mm holes spaced at a 2.54 mm pitch, making it ideal for custom circuit design and secure component layout.

This matrix board is constructed with 15/10th tinned copper clad pads of 2 mm square size on the CEM 1A substrate with a copper thickness of 35 μm, ensuring reliable conductivity and solderability for prototyping tasks. The single-sided design facilitates straightforward circuit fabrication and modification.

Compliant with ANSI/ESD S20 and BS EN 61340 standards, the board offers enhanced protection against electrostatic discharge during sensitive electronics assembly. Its flame retardant FR2 grade material adds safety and stability for extended use in industrial, laboratory, and electronics manufacturing environments.

Ideal for use as a pre-design tool, the board supports laying out electrical components securely before final fabrication. It is commonly utilized in electronics prototyping, testing, and small batch production runs.

The board material is synthetic resin bonded paper, providing rigidity and durability. Holes are precisely drilled at 1 mm diameter with a standard 2.54 mm pitch to accommodate most electronic components. Copper thickness ensures excellent electrical performance with 15/10th tinned pads enhancing solderability.

Dimensions and thickness enable compatibility with most prototyping fixtures and storage solutions. Certified to standards relevant for ESD control to protect sensitive electronics. Flame retardant FR2 material grade meets safety requirements for industrial use.

Applications include design prototyping, component layout, and custom PCB fabrication.

The package contains one CIF matrix board of model ACP22 with these exact specifications. The product is manufactured in France and arrives new, ready for immediate use in prototyping and electronics assembly projects.

Discover more precision prototyping boards and related electronic components in the Electronics Components > Matrix Board category on EnvMart.

CIF Single Sided Matrix Board Synthetic Resin Bonded Paper FR2 1 mm Holes 2.54 mm Pitch 220 x 100 x 1.6 mm ACP22
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Frequently Asked Questions

The CIF ACP22 matrix board measures 220 mm in length, 100 mm in width, and has a thickness of 1.6 mm.

This model features 1 mm diameter holes with a pitch of 2.54 mm.

It is constructed from synthetic resin bonded paper, providing rigidity and durability.

The copper thickness on this board is 35 μm.

Yes, it complies with ANSI/ESD S20 and BS EN 61340 standards for electrostatic discharge control.

It is suitable for design prototyping, component layout, and custom PCB fabrication.

This board has a single-sided design.

The board is made from FR2 grade material, which offers flame retardant properties.

The copper clad pads are sized 2 mm square on each side.

It is manufactured in France.

It is intended for use as a pre-design tool for laying out electrical components securely before final fabrication.

It is commonly utilized in electronics prototyping, testing, and small batch production runs.

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