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CHIPQUIK Solder Paste, 250 g Jar, Sn63/Pb37 No Clean, RoHS Compliant SMD291AX250T3

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CHIPQUIK Solder Paste, 250 g Jar, Sn63/Pb37 No Clean, RoHS Compliant SMD291AX250T3

Name: CHIPQUIK Solder Paste, 250 g Jar, Sn63/Pb37 No Clean, RoHS Compliant SMD291AX250T3
Brand: CHIPQUIK
SKU: 213809
Price: 65.4 USD
Availability: InStock

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Category Solder Paste Brand CHIPQUIK Condition New

Specifications

Country of Origin	Canada
Brand	CHIPQUIK
Model	SMD291AX250T3
Package Type	Jar
Package Size	250 g
Standards/Approvals	RoHS, J-STD-005A, J-STD-006C, J-STD-004B

Key Features

Contains 90.25% metal content ensuring high-quality solder joints.
Compatible with printing speeds up to 100 mm/sec for efficient PCB manufacturing.
Offers a long stencil life for extended use without degradation.
Wide process window allows flexibility in soldering conditions.
Leaves clear residue and minimizes voiding during soldering.
Exhibits excellent wetting compatibility with most board finishes.
Print grade compatible with enclosed print heads for precision application.
Passes BONO test for reliable performance in soldering processes.

Product Description

CHIPQUIK SMD291AX250T3 solder paste is an industrial-grade, 250 g jar product formulated with Sn63/Pb37 no clean alloy containing 90.25% metal content. Designed for professional electronic soldering and reflow applications, this solder paste ensures high reliability and durability in complex circuit board assembly and repair processes.

The solder paste supports printing speeds up to 100 mm/sec, allowing fast and efficient throughput on automated stencil printers. Its long stencil life maintains print quality over extended runs, reducing downtime and waste. The wide process window of this paste offers flexibility to adapt to various soldering temperatures and environments, suiting a broad range of manufacturing setups.

Producing clear, low residue after reflow, the solder paste minimizes contamination and post-process cleaning requirements. It provides minimal voiding in joints, ensuring electrical and mechanical integrity. The excellent wetting compatibility enhances adhesion and reduces defects on various PCB finishes, improving overall assembly quality.

Print grade compatibility with enclosed print heads enables precise deposits, increasing yield and consistency in surface mount device assembly. Passing the BONO test confirms this solder paste meets stringent quality standards requisite for industrial electronics manufacturing.

Ideal for industrial, electronics manufacturing, and repair workshop environments, CHIPQUIK Solder Paste SMD291AX250T3 delivers reliable performance for high-quality solder joint formation.

Contains 90.25% metal content ensuring quality solder joints. Supports printing speeds up to 100 mm/sec. Long stencil life for extended manufacturing runs. Wide process window for adaptable soldering conditions. Clear residue with low voiding for clean and reliable joints.

Excellent wetting compatibility with most PCB finishes. Compatible with enclosed print heads for precise application. Passes BONO test for guaranteed performance quality. Explore the full range of Solder Pastes and related accessories at EnvMart for your industrial soldering needs.