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MBO Lead Free Solder, SN99 Ag0.3 Cu0.7 Alloy, 217 °C Melting Point, 500g GRENAILLE SN99 AG0.3 CU0.7 - POT 500G
Specifications
| Country of Origin | France |
|---|---|
| Brand | MBO |
| Model | GRENAILLE SN99 AG0.3 CU0.7 - POT 500G |
| Melting Point | 217°C |
| Product Weight | 500g |
| Percent Lead | 0% |
| Percent Silver | 0.3% |
| Percent Tin | 99% |
| Percent Copper | 0.7% |
| MBO Lead Solder, 183 °C Melting PointBrand | MBO |
Key Features
- The solder alloy contains 99% tin, 0.3% silver, and 0.7% copper, ensuring strong and reliable solder joints.
- It is lead free, complying with environmental regulations such as RoHS 2002/95/CE.
- Supplied as bars and granules suitable for wave soldering machines and tinning crucibles.
- This product is manufactured in France and is provided in a 500g pot packaging.
- It is applicable for industrial and electronic manufacturing soldering processes requiring lead free materials.
Product Description
MBO GRENAILLE SN99 AG0.3 CU0.7 - POT 500G lead free solder is a premium alloy designed for precise soldering operations with a melting point of 217 °C. It is primarily used in industrial and electronic manufacturing environments requiring compliance with lead free standards.
This solder consists of 99% tin, 0.3% silver, and 0.7% copper, providing optimal mechanical strength and corrosion resistance in solder joints. The absence of lead ensures it meets environmental directives such as RoHS 2002/95/CE, making it suitable for eco-conscious industries.
Supplied in 500g pots, the solder is presented as bars and granules compatible with wave soldering machines and tinning crucibles, facilitating consistent melting and application. The product is manufactured in France, highlighting quality and manufacturing standards.
Typical applications include industrial soldering processes in electronics assembly, electrical components, and precision mechanical joins where lead free materials are mandated. The alloy contains 99% tin for solderability.
Includes 0.3% silver to improve joint durability. 0.7% copper enhances mechanical strength. Lead free to comply with environmental regulations. Available in 500g pot packaging.
This lead free solder by MBO is a reliable choice for manufacturing, laboratory, electronic assembly, and industrial soldering applications. Explore more from MBO in the EnvMart Solder category for compatible complementary products.
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Frequently Asked Questions
The melting point of this lead free solder is 217 °C.
The solder alloy consists of 99% tin, 0.3% silver, and 0.7% copper.
This solder is manufactured in France.
The solder is supplied in a pot that weighs 500g.
Yes, it is lead free and complies with environmental regulations such as RoHS 2002/95/CE.
This solder is suitable for industrial soldering processes in electronics assembly, electrical components, and precision mechanical joins.
The 0.3% silver improves joint durability, while the 0.7% copper enhances mechanical strength.
It is designed for precise soldering operations in industrial and electronic manufacturing environments.
No, this solder contains 0% lead, making it a lead free option.
The brand of this solder is MBO.
Specific storage or handling requirements are not provided in the product details.
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