Samtec Pin Header Unshrouded Through Hole 10 Contacts 2.54 mm Pitch 1 Row TSW-110-27-T-S

Samtec TSW-110-27-T-S Pin Header is a precisely engineered electronic connector designed for through hole mounting applications. Featuring 10 male contacts arranged in a single row with a 2.54 mm pitch, this unshrouded header provides reliable and consistent electrical connections for board-to-board interfacing.

The housing is crafted from glass filled polyester, ensuring mechanical strength and electrical insulation over a wide temperature range from -55°C to 125°C. The phosphor bronze contacts are plated with gold to maximize conductivity and resistance to corrosion, maintaining signal integrity in demanding environments.

This pin header is designed for solder termination, offering a sturdy and durable join to printed circuit boards. The contact system utilizes a 0.025 inch (0.635 mm) square post configuration which is an industry standard ensuring compatibility with a broad range of PCB footprints.

Rated for up to 550 volts, it suits a variety of industrial, electronic manufacturing, and prototyping uses, including but not limited to power distribution and signal transmission within equipment.

Glass filled polyester housing provides excellent durability and insulation. Phosphor bronze contacts with gold plating ensure high reliability and conductivity. Through-hole mount type makes it suitable for robust board connection.

Wide operating temperature range from -55°C to 125°C supports diverse environments. 10 contacts in single row with 2.54 mm pitch meet common PCB design standards. Unshrouded design allows easy visual inspection and soldering during assembly.

Contact gender is male, aligned with typical header applications. No additional certifications or approvals listed. Ideal for electronics, industrial, and manufacturing applications requiring reliable board-to-board connectors.

This Samtec PCB Pin Header is part of the TSW series recognized for flexibility and performance in electronic component assemblies. It supports high volume manufacturing environments and prototyping tasks requiring dependable board interconnections.

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